參數(shù)資料
型號: BU-61865G3-100K
廠商: DATA DEVICE CORP
元件分類: 微控制器/微處理器
英文描述: 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72
封裝: 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72
文件頁數(shù): 53/60頁
文件大?。?/td> 457K
代理商: BU-61865G3-100K
57
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
F-10/02-300
FIGURE 20. MECHANICAL OUTLINE DRAWING FOR -ACE 128-BALL BGA PACKAGE
V U T R P N M L K J H G F E D C B A
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
.0394 [1.00]
(TYP)
.815 [20.70]
(MAX)
SQUARE
.670 [17.02]
(TYP)
17 EQ.SP.
.0394 [1.00] = .670 [17.02]
(TOL NONCUM)
(TYP)
.065 [1.65]
(TYP)
.065 [1.65]
(TYP)
.032 [0.81]
(REF)
.022 [0.559] DIA
Sn/Pb BALL
(128 PLACES)
0.140 [3.58]
(MAX)
BOTTOM VIEW
SIDE VIEW
Notes:
1) Dimensions are in inches (mm).
2) Cover material: Diallyl Phthalate (DAP).
3) Base material: FR4 PC board.
4) Ball material: SnPb.
5) Solder Ball Cluster to be centralized within ±.010 of outline dimensions.
6) The copper pads (128 places) on the bottom of the BGA package are .025" (0.635 mm)
in diameter prior to processing. Final ball size is .022" (0.559 mm) after processing (typical).
Triangle denotes
Ball A1
Cover Material
Diallyl Phthalate (DAP)
FR4 P.C. Board
相關(guān)PDF資料
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