
BU-61XX0B3-202
Test Criteria:
2 = MIL-STD-1760 Amplitude Compliant
Process Requirements:
0 = Standard DDC Processing, no Burn-In
Temperature Range**/Data Requirements:
2 = -40°C to +85°C
Voltage/Transceiver Option:
3 = +5 V, rise/fall times = 100 to 300 ns (-1553B)
Package Type:
B = 128-Ball BGA Package
Logic/RAM Voltage (for BU-61860 version, 64K x 17K RAM voltage is always 5V)
0 = 3.3 V or 5.0 V Logic
Product Type:
BU-6174 = RT-only with 4K X 16 RAM
BU-6184 = BC/RT/MT with 4K X 16 RAM
BU-6186 = BC/RT/MT with 64K X 17 RAM
** Temperature Range applies to ball temperature
BU-61860B3-601
-ACE (128-ball BGA) mechanical sample, with “daisy chain” connections
of alternating balls, for use in environmental (mechanical / thermal)
integrity testing.
REV 3 - 04/06 - WEB
PRINTED IN THE U.S.A.
The information in this product brief is believed to be accurate; however,
no responsibility is assumed by Data Device Corporation for its use,
and no license or rights are granted by implication or otherwise in
connection therewith. Specifications are subject to change without notice.
DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2000
FILE NO. A5976
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www.ddc-web.com
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TEST
METHOD(S)
CONDITION(S)
MIL-STD-883
STANDARD DDC PROCESSING
2010, 2017, AND 2032
1010
B
INSPECTION
TEMPERATURE CYCLE
105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2482
For Technical Support - 1-800-DDC-5757 ext. 7771
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These products contain tin-lead solder finish as applicable to solder dip requirements.