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參數(shù)資料
| 型號(hào)： | BU-61843F4-190K |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP72 |
| 封裝： | 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 |
| 文件頁數(shù)： | 37/60頁 |
| 文件大?。?/td> | 457K |
| 代理商： | BU-61843F4-190K |
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42
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
F-10/02-300
THERMAL AND MECHANICAL MANAGEMENT FOR
-ACE (BGA PACKAGE)
Ball Grid Array (BGA) components necessitate that thermal
management issues be considered early in the design stage for
MIL-STD-1553 terminals. This is especially true if high transmit-
ter duty cycles are expected. The temperature range specified for
DDC's -ACE device refers to the temperature at the ball, not the
case.
All -ACE devices incorporate six package connections (E2, F2,
G2, U13, U14, and U15), which perform the dual function of cir-
cuit ground and thermal heat sink. Refer to FIGURE 16 for con-
nection locations. It is mandatory that these six balls be con-
Thermal Balls
(Two groups: E2, F2, G2;
and U13, U14, U15)
PC Board
-ACE
(BGA Package)
Thermal Plane
Signal Ground
Plane
Thermal Vias
Prepreg,
Approx. 0.003" thick
Top (component)
Layer
Signal Layer
0.022"
dia.
0.0394"
Pitch
Detail A
nected to a circuit ground plane (a circuit trace is insufficient)
through thermal vias as shown in FIGURE 17. Operation without
an adequate ground/thermal plane is not recommended and
extended exposure to these conditions may affect device relia-
bility.
The purpose of this ground/thermal plane is to conduct the heat
being generated by the transceivers within the package and con-
duct this heat away from the -ACE. In general, the circuit ground
and thermal (chassis) ground are not the same ground plane. It
is acceptable for these six balls to be directly soldered to a
ground plane but it must be located in close physical and thermal
proximity ("0.003" pre-preg layer recommended) to the thermal
plane (See FIGURE 17).
FIGURE 17. THERMAL DESIGN FOR -ACE (BGA PACKAGES)
FIGURE 16. THERMAL BALL LOCATIONS FOR -ACE (BGA PACKAGES)
V U T R P N M L K J H G F E D C B A
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW
Notes:
1) E2, F2, G2, U13, U14 and U15 must be connected
to a thermal plane to maintain recommended operating temperature.
(USA)
S/N
D/C
TOP VIEW
ESD and Pin 1 Identifier
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| BU-61845 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MIL-STD-1553 Components |Enhanced Mini-ACE? |
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