參數(shù)資料
型號(hào)： BU-61559
英文描述： MIL-STD-1553 Components |AIM-HY＇er
中文描述： 符合MIL - STD - 1553器件|枚AIM - HY\u0026#39;er
文件頁(yè)數(shù)： 29/32頁(yè)
文件大?。?/td> 833K
代理商： BU-61559
29
Data Device Corporation
www.ddc-web.com
BU-61559 Series
C-12/02-300
ORDERING INFORMATION
BU-61559XX-XXXX
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Source
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source and 100% Pull Test
Blank = None of the Above
Test Criteria:
0 = Standard Testing
Process Requirements:
0 = Standard DDC practices, no Burn-In
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In
Temperature Range/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
6 = Custom Part (Reserved)
7 = Custom Part (Reserved)
8 = 0°C to +70°C with Variables Test Data
Voltage Requirements:
1 = +5 Volts and -15 Volts
2 = +5 Volts and -12 Volts
Package:
D = 78-pin Ceramic QIP
F = 78-pin Ceramic Flat Pack
Product Type:
BU-61559 = AIM HY’er
* Standard DDC processing with burn-in and full temperature test. See table below.
—
1015, Table 1
BURN-IN
A
2001
CONSTANT ACCELERATION
C
1010
TEMPERATURE CYCLE
A and C
1014
SEAL
—
2009, 2010, 2017, and 2032
INSPECTION
CONDITION(S)
METHOD(S)
MIL-STD-883
TEST
STANDARD DDC PROCESSING
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