參數(shù)資料
型號(hào): BTA208X-1000C0
廠商: NXP SEMICONDUCTORS
元件分類: 晶閘管
英文描述: 3Q Hi-Com Triac
中文描述: 1000 V, 8 A, 4 QUADRANT LOGIC LEVEL TRIAC, TO-220AB
封裝: PLASTIC, TO-220, FULLPACK-3
文件頁(yè)數(shù): 6/14頁(yè)
文件大小: 162K
代理商: BTA208X-1000C0
BTA208X-1000C0
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 03 — 24 January 2011
6 of 14
NXP Semiconductors
BTA208X-1000C0
3Q Hi-Com Triac
5.
Thermal characteristics
6.
Isolation characteristics
Table 5.
Symbol
R
th(j-h)
Thermal characteristics
Parameter
thermal resistance from
junction to heatsink
Conditions
full cycle or half cycle; with heatsink
compound; see
Figure 6
full cycle or half cycle; without heatsink
compound; see
Figure 6
in free air
Min
-
Typ
-
Max
4.5
Unit
K/W
-
-
6.5
K/W
R
th(j-a)
thermal resistance from
junction to ambient
-
55
-
K/W
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
Fig 6.
Transient thermal impedance from junction to heatsink as a function of pulse duration
003aaf915
10
1
10
2
1
10
Z
th(j-h)
(K/W)
10
3
t
p
(s)
10
5
1
10
10
1
10
2
10
4
10
3
t
p
P
t
(1)
(2)
(3)
(4)
Table 6.
Symbol
V
isol(RMS)
Isolation characteristics
Parameter
RMS isolation voltage
Conditions
from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free ; 50 Hz
f
60 Hz; RH
65 %;
T
h
= 25 °C
from main terminal 2 to external
heatsink ; f = 1 MHz; T
h
= 25 °C
Min
-
Typ
-
Max
2500
Unit
V
C
isol
isolation capacitance
-
10
-
pF
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