- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369507 > BT137-500G Banana Jack; Current Rating:15A; Color:White; Contact Material:Brass; Contact Termination:Threaded; Features:"D" Body Style; Hex Size:7/16"; Insulator Material:Polycarbonate; Leaded Process Compatible:Yes; Thread Size:5/16-32 RoHS Compliant: Yes PDF資料下載
參數(shù)資料
| 型號(hào)： | BT137-500G |
| 英文描述： | Banana Jack; Current Rating:15A; Color:White; Contact Material:Brass; Contact Termination:Threaded; Features:"D" Body Style; Hex Size:7/16"; Insulator Material:Polycarbonate; Leaded Process Compatible:Yes; Thread Size:5/16-32 RoHS Compliant: Yes |
| 中文描述： | 晶閘管產(chǎn)品目錄 |
| 文件頁(yè)數(shù)： | 149/224頁(yè) |
| 文件大?。?/td> | 2697K |
| 代理商： | BT137-500G |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)當(dāng)前第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)
2002 Teccor Electronics
Thyristor Product Catalog
AN1005 - 1
http://www.teccor.com
+1 972-580-7777
5AN1005
Surface Mount Soldering Recommendations
Introduction
The most important consideration in reliability is achieving a good
solder bond between surface mount device (SMD) and substrate
since the solder provides the thermal path from the chip. A good
bond is less subject to thermal fatiguing and will result in
improved device reliability.
The most economic method of soldering is a process in which all
different components are soldered simultaneously, such as
DO-214, Compak, TO-252 devices, capacitors, and resistors.
Reflow Of Soldering
The preferred technique for mounting microminiature compo-
nents on hybrid thick- and thin-film is reflow soldering.
The DO-214 is designed to be mounted directly to or on thick-film
metallization which has been screened and fired on a substrate.
The recommended substrates are Alumina or P.C. Board mate-
rial.
Recommended metallization is silver palladium or molymanga-
nese (plated with nickel or other elements to enhance solderabil-
ity). For more information, consult Du Pont's Thick-Film
handbook or the factory.
It is best to prepare the substrate by either dipping it in a solder
bath or by screen printing a solder paste.
After the substrate is prepared, devices are put in place with
vacuum pencils. The device may be laid in place without special
alignment procedures since it is self-aligning during the solder
reflow process and will be held in place by surface tension.
For reliable connections, keep the following in mind:
(1) Maximum temperature of the leads or tab during the solder-
ing cycle does not exceed 275 °C.
(2) Flux must affect neither components nor connectors.
(3) Residue of the flux must be easy to remove.
Good flux or solder paste with these properties is available on the
market. A recommended flux is Alpha 5003 diluted with benzyl
alcohol. Dilution used will vary with application and must be
determined empirically.
Having first been fluxed, all components are positioned on the
substrate. The slight adhesive force of the flux is sufficient to
keep the components in place.
Because solder paste contains a flux, it has good inherent adhe-
sive properties which eases positioning of the components. Allow
flux to dry at room temperature or in a 70 °C oven. Flux should be
dry to the touch. Time required will depend on flux used.
With the components in position, the substrate is heated to a
point where the solder begins to flow. This can be done on a
heating plate, on a conveyor belt running through an infrared tun-
nel, or by using vapor phase soldering.
In the vapor phase soldering process, the entire PC board is uni-
formly heated within a vapor phase zone at a temperature of
approximately 215 °C. The saturated vapor phase zone is
obtained by heating an inert (inactive) fluid to the boiling point.
The vapor phase is locked in place by a secondary vapor. (Figure
AN1005.1) Vapor phase soldering provides uniform heating and
prevents overheating.
Figure AN1005.1
Principle of Vapor Phase Soldering
No matter which method of heating is used, the maximum
allowed temperature of the plastic body must not exceed 250 °C
during the soldering process. For additional information on tem-
perature behavior during the soldering process, see Figure
AN1005.2 and Figure AN1005.3.
Figure AN1005.2
Reflow Soldering Profile
Transport
Cooling pipes
PC board
Heating
elements
Boiling liquid (primary medium)
Vapor phase
zone
Vapor lock
(secondary
medium)
Time (Seconds)
0
0
20
40
60
80
100
120
140
160
180
200
220
240
30
60
90
120
150
180
210
240
270
300
T
Pre-heat
Soak
Reflow
Cool
Down
0.5 - 0.6
C/s
1.3 - 1.6
C/s
<2.5
C/s
<2.5
C/s
Pe220
C - 245
C
Soaking Zone
Reflow Zone
Pre-heating Zone
( 2-4 min MAX )
( 2 min. MAX )
60 - 90 s typical
( 2 min. MAX )
30 - 60 s typical
260
AN1005
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BT137-600D | Hook-Up Wire; Conductor Size AWG:22; No. Strands x Strand Size:7 x 30; Jacket Color:Gray; Approval Bodies:UL, CSA; Approval Categories:UL AWM Styles 1007, 1565; CSA Types TR-64, TRSR-64; JQA-F; Passes VW-1 Flame Test RoHS Compliant: Yes |
| BT137-600E | Hook-Up Wire; Conductor Size AWG:22; No. Strands x Strand Size:7 x 30; Jacket Color:Gray; Approval Bodies:UL, CSA; Approval Categories:UL AWM Styles 1007, 1565; CSA Types TR-64, TRSR-64; JQA-F; Passes VW-1 Flame Test RoHS Compliant: Yes |
| BT137-600G | Hook-Up Wire; Conductor Size AWG:22; No. Strands x Strand Size:7 x 30; Jacket Color:Black; Approval Bodies:UL, CSA; Approval Categories:UL AWM Styles 1007, 1565; CSA Types TR-64, TRSR-64; JQA-F; Passes VW-1 Flame Test RoHS Compliant: Yes |
| BT137-800G | WIRE, PVC #22 BLACK* |
| BT137X-600D | Thyristor Product Catalog |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BT137-500G/B | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRIAC 8A TO-220 |
| BT137600 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triacs |
| BT137-600 | 制造商:NXP Semiconductors 功能描述:Thyristor TRIAC 600V 71A 3-Pin (3+Tab) TO-220AB Bulk 制造商:NXP Semiconductors 功能描述:TRIAC 8A 600V TO-220 制造商:NXP Semiconductors 功能描述:TRIAC, 8A, 600V, TO-220 制造商:NXP Semiconductors 功能描述:Thyristor TRIAC 600V 71A 3-Pin(3+Tab) TO-220AB |
| BT137-600,127 | 功能描述:雙向可控硅 600V 8A RoHS:否 制造商:STMicroelectronics 開(kāi)啟狀態(tài) RMS 電流 (It RMS):16 A 不重復(fù)通態(tài)電流:120 A 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:600 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）:5 uA 開(kāi)啟狀態(tài)電壓: 保持電流（Ih 最大值）:45 mA 柵觸發(fā)電壓 (Vgt):1.3 V 柵觸發(fā)電流 (Igt):1.75 mA 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:TO-220AB |
| BT137-600 | 制造商:NXP Semiconductors 功能描述:TRIAC 8A 600V TO-220 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。