- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369509 > BT136SERIESD Triacs logic level PDF資料下載
參數(shù)資料
| 型號(hào)： | BT136SERIESD |
| 英文描述： | Triacs logic level |
| 中文描述： | 雙向可控硅邏輯電平 |
| 文件頁(yè)數(shù)： | 151/224頁(yè) |
| 文件大?。?/td> | 2697K |
| 代理商： | BT136SERIESD |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)當(dāng)前第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)
Application Notes
AN1005
2002 Teccor Electronics
Thyristor Product Catalog
AN1005 - 3
http://www.teccor.com
+1 972-580-7777
Wave Soldering
Wave soldering is the most commonly used method for soldering
components in PCB assemblies. As with other soldering pro-
cesses, a flux is applied before soldering. After the flux is
applied, the surface mount devices are glued into place on a PC
board. The board is then placed in contact with a molten wave of
solder at a temperature between 240 °C and 260 °C, which
affixes the component to the board.
Dual wave solder baths are also in use. This procedure is the
same as mentioned above except a second wave of solder
removes excess solder.
Although wave soldering is the most popular method of PCB
assembly, drawbacks exist. The negative features include solder
bridging and shadows (pads and leads not completely wetted) as
board density increases. Also, this method has the sharpest ther-
mal gradient. To prevent thermal shock, some sort of pre-heating
device must be used. Figure AN1005.6 shows the procedure for
wave soldering PCBs with surface mount devices only. Figure
AN1005.7 shows the procedure for wave soldering PCBs with
both surface mount and leaded components.
Figure AN1005.6
Wave Soldering PCBs With Surface Mount Devices
Only
Figure AN1005.7
Wave Soldering PCBs With Both Surface Mount
and Leaded Components
Immersion Soldering
Maximum allowed temperature of the soldering bath is 235 °C.
Maximum duration of soldering cycle is five seconds, and forced
cooling must be applied.
Hand Soldering
It is possible to solder the DO-214, Compak, and TO-252 devices
with a miniature hand-held soldering iron, but this method has
particular drawbacks and should be restricted to laboratory use
and/or incidental repairs on production circuits.
Recommended Metal-alloy
(1) 63/37 Sn/Pb
(2) 60/40 Sn/Pb
Pre-Heating
Pre-heating is recommended for good soldering and to avoid
damage to the DO-214, Compak, TO-252 devices, other compo-
nents, and the substrate. Maximum pre-heating temperature is
165 °C while the maximum pre-heating duration may be 10 sec-
onds. However, atmospheric pre-heating is permissible for sev-
eral minutes provided temperature does not exceed 125 °C.
Screen print glue
Wave solder
Apply glue
Cure glue
Place component
or
PC board
Insert
leaded
components
Turn over the
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over the
PC board
Wave solder
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BT136SERIESE | Triacs sensitive gate |
| BT136SSERIES | Triacs |
| BT136SSERIESD | Triacs logic level |
| BT136X_SERIES | Triacs |
| BT136X_SERIES_D | Triacs logic level |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BT136SERIESE | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Triacs sensitive gate |
| BT136SSERIES | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Triacs |
| BT136SSERIESD | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Triacs logic level |
| BT136SSERIESE | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triacs sensitive gate |
| BT136X | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Triacs sensitive gate |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。