2002 Teccor Electronics
Thyristor Product Catalog
P - 9
http://www.teccor.com
+1 972-580-7777
Quality and Reliability
Reliability Stress Tests
The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a peri-
odic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests
may be performed when appropriate.
Flammability Test
For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories
Test Type
High Temperature
AC Blocking
Typical Conditions
Test Description
Standards
T
A
= 100 °C to 150 °C, Bias @
100%
Rated V
DRM
, t = 24 hrs to 1000 hrs
Evaluation of the reliability of
product under bias conditions
and elevated temperature
MIL-STD-750, M-1040
High Temperature
Storage Life
T
A
= 150 °C, t = 250 to 1000 hrs
Evaluation of the effects on
devices after long periods of
storage at high temperature
MIL-STD-750, M-1031
Temperature and Humidity
Bias Life
T
A
= 85 °C to 95 °C, rh = 85% to
95%
Bias @ 80% Rated V
DRM
(320 VDC max)
t = 168 to 1008 hrs
Evaluation of the reliability of non-
hermetic packaged devices in
humid environments
EIA / JEDEC, JESD22-A101
Temperature Cycle
[Air to Air]
T
A
= -65 °C to 150 °C,
cycles = 10 to 500
Evaluation of the device’s ability
to withstand the exposure to
extreme temperatures and the
forces of TCE during transitions
between temperatures
MIL-STD-750, M-1051,
EIA / JEDEC, JESD22-A104
Thermal Shock
[Liquid to Liquid]
T
A
= 0 °C to 100 °C, t
txfr
=
≤
10 s,
cycled = 10 to 20
Evaluation of the device’s ability
to withstand the sudden changes
in temperature and exposure to
extreme temperatures
MIL-STD-750, M-1056
Autoclave
T
A
= 121 °C, rh = 100%, P = 15 psig,
t = 24 hrs to 168 hrs
Accelerated environmental test to
evaluate the moisture resistance
of plastic packages
EIA / JEDEC, JESD22-A102
Resistance to
Solder Heat
T
A
= 260 °C, t = 10 s
Evaluation of the device’s ability
to withstand the temperatures as
seen in wave soldering
operations
MIL-STD-750, M-2031
Solderability
Steam aging = 1 hr to 8 hrs,
T
solder
= 245 °C, Flux = R
Evaluation of the solderability of
device terminals after an
extended period
MIL-STD-750, M-2026,
ANSI-J-STD-002