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參數(shù)資料
| 型號(hào)： | BLM41PG750SN1D |
| 廠(chǎng)商： | MURATA MANUFACTURING CO LTD |
| 元件分類(lèi)： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, 3 A, FERRITE CHIP |
| 封裝： | EIA STD PACKAGE SIZE 1806 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 196K |
| 代理商： | BLM41PG750SN1D |
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
2
Continued from the preceding page.
Continued on the following page.
(1) Solder Paste Printing
BLM Series
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100
m to 200m.
(2) Adhesive Application
BLM Series
o Coating amount is illustrated in the following diagram.
(1) SOLDERING METHODS
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100
m to 200m.
(2) SOLDERING TEMPERATURE AND TIME
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble fulx.
3. Standard Soldering Conditions
0
.2
0
.3
m
in
a:20
m70m
b:30
m35m
c:50
m105m
c
a
b
Chip Solid Inductor
Bonding agent
Land
PCB
270
280
260
250
240
230
0
5
10
15
20
25
30
Time [s]
T
e
m
p
e
ra
tu
re
[°
C
]
270
280
260
250
240
230
0
20
30
40
50
60
70
80
90
T
e
m
p
e
ra
tu
re
[°
C
]
BLM
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
BLM
(Except for BLM15)
BLM Series Notice (Soldering and Mounting)
61
2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BLM41PG750SN1J | 1 FUNCTIONS, 3 A, FERRITE CHIP |
| BLM41PF800SN1B | 1 FUNCTIONS, 1 A, FERRITE CHIP |
| BLM41PF800SN1K | 1 FUNCTIONS, 1 A, FERRITE CHIP |
| BLP-1000 | 990 MHz, LOW PASS FILTER |
| BLP-100 | 108 MHz, LOW PASS FILTER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BLM41PG750SN1J | 制造商:MURATA 制造商全稱(chēng):Murata Manufacturing Co., Ltd. 功能描述:EMIFIL (Inductor type) Chip Ferrite Bead BLM41P Series (1806 Size) |
| BLM41PG750SN1K | 制造商:MURATA 制造商全稱(chēng):Murata Manufacturing Co., Ltd. 功能描述:EMIFIL (Inductor type) Chip Ferrite Bead BLM41P Series (1806 Size) |
| BLM41PG750SN1L | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 75 OHM RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類(lèi)型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| BLM41PG750SN1L | 制造商:Murata Manufacturing Co Ltd 功能描述:INDUCTOR SMD 75Z |
| BLM41PG750SZ1L | 功能描述:FERRITE BEAD 75 OHM 1806 1LN 制造商:murata electronics north america 系列:BLM 零件狀態(tài):在售 濾波器類(lèi)型:電源線(xiàn) 線(xiàn)路數(shù):1 不同頻率時(shí)的阻抗:75 Ohms @ 100MHz 額定電流（最大）:3.5A 直流電阻（DCR）（最大）:150 毫歐 等級(jí):- 工作溫度:-55°C ~ 125°C 封裝/外殼:1806（4516 公制） 安裝類(lèi)型:表面貼裝 高度（最大值）:0.071"（1.80mm） 大小/尺寸:0.177" 長(zhǎng) x 0.063" 寬（4.50mm x 1.60mm） 標(biāo)準(zhǔn)包裝:2,500 |
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