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參數(shù)資料
| 型號(hào)： | BLM41PG102SN1D |
| 廠商： | MURATA MANUFACTURING CO LTD |
| 元件分類： | 數(shù)據(jù)傳輸濾波器 |
| 英文描述： | 1 FUNCTIONS, 1.5 A, FERRITE CHIP |
| 封裝： | EIA STD PACKAGE SIZE 1806 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大小： | 196K |
| 代理商： | BLM41PG102SN1D |
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
1
Continued on the following page.
1. Standard Land Pattern Dimensions
Do not apply narrower pattern than listed above to
BLM_P.
Narrow pattern can cause excessive heat or open circuit.
BLM15 (Reflow)
BLM18 (Flow)
BLM18 (Reflow)
BLM21
BLM31
BLM41
BLM15 is specially adapted for refiow soldering.
1.0
1.6
2.0
3.2
4.5
0.5
0.8
1.25
1.6
Type
Size (mm)
L
0.4
0.7
1.2
2.0
3.0
a
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
5.5-6.5
b
W
0.5
0.7
1.0
1.2
c
a
b
BLM Series
(Except BLM21P/31P/41P)
BLM21P/31P/41P
BLM21PG331SN1
BLM21PG221SN1
BLM21PG300SN1
BLM21PG600SN1
BLM21PG220SN1
BLM31PG330SN1
BLM31PG500SN1
BLM31PG121SN1
BLM31PG391SN1
BLM31PG601SN1
BLM41PF800SN1
BLM41PG102SN1
BLM41PG471SN1
BLM41PG750SN1
BLM41PG181SN1
BLM41PG600SN1
1.5
2
3
6
3
2
1.5
1
1.5
2
3
6
1.0
1.2
Type
Size (mm)
Land pad thickness
and Dimension d
Rated
Current
(A)
1.2
2.0
3.0
a
3.0-4.0
4.5-5.2
5.5-6.5
b
c
1.0
1.2
2.4
6.4
2.4
1.2
2.4
6.4
1.0
1.2
3.3
1.2
3.3
1.00
1.65
1.20
1.65
18
m 35m 70m
2. Solder Paste Printing and Adhesive Application
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions. If too much
solder is applied, the chip will prone to be damaged by
mechanical and thermal stress from the PCB and may
crack. In contrast, if too little solder is applied, there is the
potential that the termination strength will be insufficient,
creating the potential for detachment. Standard land
dimensions should be used for resist and copper foil
patterns.
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions. If
too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
a
b
d
(P
a
tt
e
rn
)
c
Land Pattern
Solder Resist
Flow Mounting in High Density for BLM31/41
c
b
d
a
2
.5
P
it
c
h
e
BLM31
BLM41
2.0
3.0
1.2
Type
Size (mm)
a
1.3
1.8
d
4.2-5.2
5.5-6.5
b
c
1.35
1.5
e
BLM Series Notice (Soldering and Mounting)
60
2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BLM41PG102SN1J | 1 FUNCTIONS, 1.5 A, FERRITE CHIP |
| BLM41PG181SN1C | 1 FUNCTIONS, 3 A, FERRITE CHIP |
| BLM41PG181SN1D | 1 FUNCTIONS, 3 A, FERRITE CHIP |
| BLM41PG181SN1J | 1 FUNCTIONS, 3 A, FERRITE CHIP |
| BLM41PG471SN1C | 1 FUNCTIONS, 2 A, FERRITE CHIP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BLM41PG102SN1J | 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:EMIFIL (Inductor type) Chip Ferrite Bead BLM41P Series (1806 Size) |
| BLM41PG102SN1K | 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:EMIFIL (Inductor type) Chip Ferrite Bead BLM41P Series (1806 Size) |
| BLM41PG102SN1L | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 1K OHM RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| BLM41PG181SH1L | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 180ohms Power Supply Tape RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
| BLM41PG181SN1 | 制造商:MURATA 制造商全稱:Murata Manufacturing Co., Ltd. 功能描述:On-Board Type (DC) EMI Suppression Filters |
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