參數(shù)資料
型號: BLM41PF800SN1C
廠商: MURATA MANUFACTURING CO LTD
元件分類: 數(shù)據(jù)傳輸濾波器
英文描述: 1 FUNCTIONS, 1 A, FERRITE CHIP
封裝: EIA STD PACKAGE SIZE 1806
文件頁數(shù): 8/9頁
文件大小: 196K
代理商: BLM41PF800SN1C
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
2
Continued from the preceding page.
Continued on the following page.
(1) Solder Paste Printing
BLM Series
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100
m to 200m.
(2) Adhesive Application
BLM Series
o Coating amount is illustrated in the following diagram.
(1) SOLDERING METHODS
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100
m to 200m.
(2) SOLDERING TEMPERATURE AND TIME
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble fulx.
3. Standard Soldering Conditions
0
.2
0
.3
m
in
a:20
m70m
b:30
m35m
c:50
m105m
c
a
b
Chip Solid Inductor
Bonding agent
Land
PCB
270
280
260
250
240
230
0
5
10
15
20
25
30
Time [s]
T
e
m
p
e
ra
tu
re
C
]
270
280
260
250
240
230
0
20
30
40
50
60
70
80
90
T
e
m
p
e
ra
tu
re
C
]
BLM
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
BLM
(Except for BLM15)
BLM Series Notice (Soldering and Mounting)
61
2
相關(guān)PDF資料
PDF描述
BLM41PF800SN1D 1 FUNCTIONS, 1 A, FERRITE CHIP
BLM41PF800SN1J 1 FUNCTIONS, 1 A, FERRITE CHIP
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BLM41PG102SN1D 1 FUNCTIONS, 1.5 A, FERRITE CHIP
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BLM41PF800SN1L 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 80 OHM RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric)
BLM41PF800SN1L 制造商:Murata Manufacturing Co Ltd 功能描述:INDUCTOR SMD 80Z
BLM41PG101SH1L 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 100ohm Supply Tape RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric)
BLM41PG101SN1L 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 100ohms Power Supply Tape RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric)
BLM41PG102SH1L 功能描述:電磁干擾濾波珠子、扼流圈和陣列 1806 1Kohms Power Supply Tape RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric)