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參數(shù)資料
| 型號： | BG400078 |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Low Current Operation at 250 ，Low Reverse Leakage,Low Noise Zener Diode |
| 中文描述： | 250 的低電流運(yùn)算，低反向泄露，低噪聲穩(wěn)壓二極管 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 21K |
| 代理商： | BG400078 |
Gap Pad VO
Conformable, Thermally Conductive Material for Filling Air Gaps
The Bergquist Company
North American Headquarterss
18930 West 78
Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-4156
The Bergquist Company-Europe
Bramenberg 9a
3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company-Asia
9F-1, No. 314, Section 4
Ren Ai Road
Taipei, Taiwan, ROC 106
Phone: 886-2-2700-7796
Fax: 886-2-2700-7795
www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE,
DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser
not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
Gap Pad VO is a thermally conductive cost effective
material that acts as a thermal interface between a heat
sink and an electronic device. The conformable nature of
Gap Pad VO allows the pad to fill in air gaps between PC
boards and heat sinks or a metal chassis.
Gap Pad VO is a filled thermally conductive polymer
supplied on a rubber coated fiberglass carrier allowing for
easy material handling and enhanced puncture, shear, and
tear resistance. The material is available in thickness from
0.020” to 0.250” with a removable liner applied to the
light pink side of the material. The range in thickness and
the materials flexibility allow Gap Pad VO to be used in a
variety of applications where surface texture vary and the
space between surfaces is uneven.
To calculate the approximate amount of deflection for a specific material
thickness, at a given pressure, refer to the graph below. Multiply the thickness
of the material by the percentage at the given pressure.*
The resultant thickness of the Gap Pad will determine the thermal resistance.
Subtracting the initial gap pad thickness by the deflection value, obtained above,
will give the resultant thickness. Refer to the graph below to obtain the thermal
resistance of the material.
Typical Properties of Gap Pad VO
Property
Typical Value
Test
Method
Visual
ASTM D374
ASTM D792
ASTM C351
Color
Thickness
Specific Gravity
Heat Capacity
Hardness
(Shore Type 00)
Gold / Pink
0.020” to 0.250”
1.6 g/cc
1.0 J/g-K
Thickness
.020” - .250”
Hardness
80 - 40
Rate
0.01”/min.
ASTM D2240
Modulus
100
Young’s Modulus psi
(1)
ASTMD575
Continuous Use
Temp.
Electrical
-60
°
C to 200
°
C
Dielectric Breakdown
Voltage
Dielectric Constant
Volume Resistivity
Flame Rating
Thermal
Thermal
Conductivity
>6 kV
ASTM D149
5.5
ASTM D150
ASTM D257
U.L.
10
11
Ohm-meter
94 V-O
0.8 W/m-K
ASTM D5470
(1)
Graphs and data generated from Young’s Modulus, calculated
using 0.01 inch/min. step rate of strain with a sample size of 0.79
inch
2
. For more information on Gap Pad modulus refer to
Bergquist Application Note #116.
Gap Pad VO is available in die-cut parts and sheets.
Standard sheet size is 8” X 16”, with or without adhesive.
Pressure vs. Percent Deflection Gap Pad
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
Percent Deflection (%)
20
25
30
35
40
45
50
P
Thickness vs. Thermal Resistance Gap Pad
0
50
100
150
200
250
1
2
3
4
5
6
7
8
9
10
11
12
13
Thermal Resistance (deg C*sq in/W)
T
Rev: Aug. 22, 2001
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