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參數(shù)資料
| 型號(hào)： | BD1722N5050AHF |
| 廠商： | Anaren |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 3316K |
| 描述： | XFRMR BALUN RF 1700-2200MHZ 0404 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Xinger® |
| 頻率范圍： | 1700 ~ 2200MHz |
| 阻抗 - 不平衡/平衡： | 50 / 50 歐姆 |
| 相差： | 3.42° |
| 插入損耗（最大值）： | 1.02dB |
| 回程損耗（最小值）： | 12.5dB |
| 封裝/外殼： | 4-SMD，無引線 |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 1173-1060-6 |
Visit us at
www.Anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282
Model BD1722N5050AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
With No DC Bias
With DC Bias
.50
3x .29
.50
Plated thru
hole to
ground
.33
.22
.22
3x Transmission
Line
3x .29
Dimensions are in Millimeters
Mounting Footprint
Solder Resist
Footprint Pad (s)
Circuit Pattern
3x .29
3x .29
.50
.33
.33
.50
3x Transmission
Line
.22
.22
Plated thru
hole to
ground
Dimensions are in Millimeters
Mounting Footprint
Solder Resist
Footprint Pad (s)
Circuit Pattern
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| BD175 | 制造商:TRSYS 制造商全稱:Transys Electronics 功能描述:EPITAXIAL SILICON POWER TRANSISTORS |
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