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參數(shù)資料
| 型號(hào)： | BD0826J50200AHF |
| 廠商： | Anaren |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 3373K |
| 描述： | XFRMR BALUN RF 800-2600MHZ 0805 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Xinger® |
| 頻率范圍： | 800MHz ~ 2.6GHz |
| 阻抗 - 不平衡/平衡： | 50 / 200 歐姆 |
| 相差： | 3° |
| 插入損耗（最大值）： | 1.5dB |
| 回程損耗（最小值）： | 8.5dB |
| 封裝/外殼： | 0805（2012 公制） |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 1173-1058-6 |
Visit us at
www.anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282
odel B 826J50200AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
Bi F
rin
6x .41
6x .33
.04
4x .25
.66
3x Transmission
lines
Plated thru holes to ground
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
DC Bias Footprint
6x .41
6x .33
.04
4x .25
.66
3x Transmission
lines
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
Capacitor
Plated thru
holes to
ground
DC Bias
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