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參數(shù)資料
| 型號： | BC337-25RL1 |
| 英文描述： | IC CONFIG DEVICE 440KBIT 32-TQFP |
| 中文描述： | 晶體管|晶體管|叩| 45V的五（巴西）總裁| 800mA的一（c）|至92 |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 153K |
| 代理商： | BC337-25RL1 |
BC337
BC337A
BC338
TO-92
Plastic Package
TO-92 Plastic Package
TO-92 Transistors on Tape and Ammo Pack
CUMULATIVE PITCH
ERROR 1.0 mm/20
PITCH
TO BE MEASURED AT
BOTTOM OF CLINCH
AT TOP OF BODY
t1 0.3 - 0.6
BODY WIDTH
BODY HEIGHT
BODY THICKNESS
PITCH OF COMPONENT
FEED HOLE PITCH
FEED HOLE CENTRE TO
COMPONENT CENTRE
DISTANCE BETWEEN OUTER
LEADS
COMPONENT ALIGNMENT
TAPE WIDTH
HOLD-DOWN TAPE WIDTH
HOLE POSITION
HOLD-DOWN TAPE POSITION
LEAD WIRE CLINCH HEIGHT
COMPONENT HEIGHT
LENGTH OF SNIPPED LEADS
FEED HOLE DIAMETER
TOTAL TAPE THICKNESS
LEAD - TO - LEAD DISTANCEF1,
CLINCH HEIGHT
PULL - OUT FORCE
ITEM
A1
A
T
P
Po
P2
F
h
W
Wo
W1
W2
Ho
H1
L
Do
t
F2
H2
(P)
SYMBOL
SPECIFICATION
NOM.
4.0
4.8
3.9
6N
MIN.
12.7
12.7
6.35
5.08
0
18
6
9
0.5
16
4
2.54
4.8
5.2
4.2
1
23.25
11.0
1.2
3
MAX.
±1
±0.3
±0.4
+0.6
-0.2
±0.5
±0.2
+0.7
-0.5
±0.2
±0.5
±0.2
+0.4
-0.1
TOL .
REMARKS
NOTES
1. MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2 mm.
2. MAXIMUM NON-CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1 mm IN 20
PITCHES.
3. HOLDDOWN TAPE NOT TO EXCEED BEYOND THE EDGE(S) OF CARRIER TAPE AND THERE SHALL BE NO
EXPOSURE OF ADHESIVE.
4. NO MORE THAN 3 CONSECUTIVE MISSING COMPONENTS ARE PERMITTED.
5. A TAPE TRAILER, HAVING AT LEAST THREE FEED HOLES ARE REQUIRED AFTER THE LAST COMPONENT.
6. SPLICES SHALL NOT INTERFERE WITH THE SPROCKET FEED HOLES.
All dimensions in mm unless specified otherwise
Ammo Pack Style
Adhesive Tape on Top Side
FLAT SIDE
MECHANICAL DATA
T
t1
t
F1
F2
F
P2
Po
Do
(p)
W2
Wo
W1
W
H1
A
A1
P
H0
L
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Ammo Pack
LABEL
Carrier
Strip
8.2"
13"
FEED
177"
h
h
TO-92 Bulk
TO-92 T&A
1K/polybag
2K/ammo box
200 gm/1K pcs
645 gm/2K pcs
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5K
2K
17" x 15" x 13.5"
17" x 15" x 13.5"
80K
32K
23 kgs
12.5 kgs
PACKAGE
Net Weight/Qty
Details
STANDARD PACK
INNER CARTON BOX
Qty
OUTER CARTON BOX
Qty
Gr Wt
Size
Size
Packing Detail
PIN CONFIGURATION
1. EMITTER
2. BASE
3. COLLECTOR
B
A
L
S
D
U
B
K
E
D
A A
SEC AA
G
D
3
21
1
2
3
F
F
H
C
3 2 1
All diminsions in mm.
DIM
MIN.
MAX.
A
B
C
D
E
F
G
H
K
L
4.32
4.45
3.18
0.41
0.35
5.33
5.20
4.19
0.55
0.50
5 DEG
1.14
1.14
12.70
1.982
1.40
1.53
—
2.082
Continental Device India Limited
Data Sheet
Page 3 of 4
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BC337-25RL1G | 功能描述:兩極晶體管 - BJT 800mA 50V NPN RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
| BC337-25RLRAG | 功能描述:TRANS NPN 45V 0.8A 制造商:on semiconductor 系列:- 包裝:帶卷（TR） 零件狀態(tài):過期 晶體管類型:NPN 電流 - 集電極（Ic）（最大值）:800mA 電壓 - 集射極擊穿（最大值）:45V 不同?Ib，Ic 時的?Vce 飽和值（最大值）:700mV @ 50mA，500mA 電流 - 集電極截止（最大值）:100nA 不同?Ic，Vce?時的 DC 電流增益（hFE）（最小值）:160 @ 100mA，1V 功率 - 最大值:625mW 頻率 - 躍遷:210MHz 安裝類型:通孔 封裝/外殼:TO-226-3，TO-92-3（TO-226AA）（成形引線） 供應(yīng)商器件封裝:TO-92（TO-226） 標(biāo)準(zhǔn)包裝:2,000 |
| BC33725TA | 功能描述:兩極晶體管 - BJT NPN 45V 800mA HFE/400 RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
| BC337-25TA | 制造商:Fairchild Semiconductor Corporation 功能描述: |
| BC33725TAR | 功能描述:兩極晶體管 - BJT NPN Si Transistor Epitaxial RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2 |
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