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參數(shù)資料
| 型號： | BC302-4 |
| 英文描述： | Stratix GX FPGA 25K 8-FBGA |
| 中文描述： | 晶體管|晶體管|叩| 45V的五（巴西）總裁| 500mA的一（c）| TO - 39封裝 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 11K |
| 代理商： | BC302-4 |
BC300-4
Bipolar NPN Device.
V
CEO
= 80V
I
C
= 1A
All Semelab hermetically sealed products
can be processed in accordance with the
requirements of BS, CECC and JAN,
JANTX, JANTXV and JANS specifications
Parameter
Test Conditions
Min.
Typ.
Max.
Units
V
CEO
*
80
V
I
C(CONT)
1
A
h
FE
@ 10/0.15 (V
CE
/ I
C
)
40
80
-
f
t
120M
Hz
P
D
0.85
W
* Maximum Working Voltage
This is a shortform datasheet. For a full datasheet please contact
sales@semelab.co.uk
.
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Generated
1-Aug-02
Bipolar NPN Device in a
Hermetically sealed TO39
Metal Package.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail:
sales@semelab.co.uk
Website:
http://www.semelab.co.uk
Dimensions in mm (inches).
(0.89
12.70
(0.500)
min.
0.41 (0.016)
0.53 (0.021)
dia.
5.08 (0.200)
typ.
0.71 (0.028)
(2.54
45°
6.10 (0.240)
6.60 (0.260)
8.51 (0.34)
9.40 (0.37)
7.75 (0.305)
8.51 (0.335)
1
2
3
0.74 (0.029)
TO39 (TO205AD)
PINOUTS
1 – Emitter
2 – Base
3 – Collector
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| BC302-6 | CYCLONE III FPGA 119K 484FBGA |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BC30-25 | 制造商:Thomas & Betts 功能描述:CABLE,BATTERY |
| BC302-5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | BJT | NPN | 45V V(BR)CEO | 500MA I(C) | TO-39 |
| BC30-25R | 制造商:Thomas & Betts 功能描述:VALON BATT CABL |
| BC302-6 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TRANSISTOR | BJT | NPN | 45V V(BR)CEO | 500MA I(C) | TO-39 |
| BC302J1K | 功能描述:NTC Thermistor 3k Nonstandard Chip 制造商:us sensor 系列:BC 包裝:散裝 零件狀態(tài):有效 25°C 時(shí)歐姆阻值:3k 電阻容差:±10% B 值容差:- B0/50:3892K B25/50:- B25/75:- B25/85:- B25/100:- 工作溫度:150°C 功率 - 最大值:- 長度 - 引線:- 安裝類型:表面貼裝 封裝/外殼:非標(biāo)準(zhǔn)型芯片 標(biāo)準(zhǔn)包裝:1 |
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