參數(shù)資料
型號: BAS70TW
廠商: Diodes Inc.
英文描述: SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
中文描述: 表面貼裝肖特基二極管陣列
文件頁數(shù): 3/5頁
文件大小: 231K
代理商: BAS70TW
BAS70J / BAS70W / BAS70-04W /
BAS70-05W / BAS70-06W
3/5
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1E-4
1E-3
1E-2
7E-2
VFM(V)
IFM(A)
TyTj=100°C
Tj=25°C
Maximum values
Tj=25°C
Typical values
Fig. 1:
Forward voltage drop versus forward
current.
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70
1E-3
1E-2
1E-1
1E+0
1E+1
VR(V)
IR(μA)
Tj=25°C
Tj=100°C
Fig. 2:
Reverse leakage current versus reverse
voltage applied (typical values).
0
25
50
75
100
125
150
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Tj(°C)
IR(μA)
VR=70V
Fig. 3:
Reverse leakage current versus junction
temperature (typical values).
1
10
100
0.1
1.0
2.0
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig. 4:
Junction capacitance versus reverse
voltage applied (typical values).
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
0.01
0.10
1.00
tp(s)
Zth(j-a)/Rth(j-a)
Single pulse
δ
= 0.1
δ
= 0.2
δ
= 0.5
T
δ
=tp/T
tp
Fig. 5:
Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
FR4
with
recommended
S(Cu)=35
μ
m).
pad
layout,
0
5
10
15
20
25
30
35
40
45
50
300
350
400
450
500
550
600
S(Cu) (mm2)
Rth(j-a) (°C/W)
P=0.2W
Fig. 6:
Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness:
35
μ
m).
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