
BAL99
www.vishay.com
Vishay Semiconductors
Rev. 1.9, 15-May-13
For technical questions within your region:
DiodesAmericas@vishay.com
,
DiodesAsia@vishay.com
,
DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc91000
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Document Number: 85535
Small Signal Fast Switching Diode
MECHANICAL DATA
Case:
SOT-23
Weight:
approx. 8.8 mg
Packaging codes/options:
18/10K per 13
"
reel (8 mm tape), 10K/box
08/3K per 7
"
reel (8 mm tape), 15K/box
FEATURES
Fast switching speed
Surface mount package
Well suited for automated assembly process
AEC-Q101 qualified
Base P/N-E3 - RoHS-compliant, commercial
grade
Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified
Material categorization: For definitions of compliance
please see
www.vishay.com/doc99912
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2
3
PARTS TABLE
PART
ORDERING CODE
BAL99-E3-08 or BAL99-E3-18
BAL99-HE3-08 or BAL99-HE3-18
INTERNAL CONSTRUCTION
TYPE MARKING
REMARKS
BAL99
Single diode
JF
Tape and reel
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Repetitive peak reverse voltage
= working peak reverse voltage
= DC blocking voltage
TEST CONDITION
SYMBOL
VALUE
UNIT
V
RRM
= V
RWM
= V
R
70
V
Peak forward surge current
t
p
= 1 μs
t
p
= 1 ms
t
p
= 1 s
I
FSM
I
FSM
I
FSM
I
FAV
2
1
A
A
A
0.5
250
Average forward current
mA
Power dissipation
On fiberglass substrate
30 mm x 10 mm x 1.6 mm
P
tot
350
mW
THERMAL CHARACTERISTICS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
On fiberglass substrate
30 mm x 10 mm x 1.6 mm
SYMBOL
VALUE
UNIT
Thermal resistance junction to ambient air
R
thJA
357
K/W
Junction temperature
Storage temperature range
Operating temperature range
T
j
150
°C
°C
°C
T
stg
T
op
- 55 to + 150
- 55 to + 150