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參數(shù)資料
| 型號： | B0430J50100AHF |
| 廠商： | Anaren |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 312K |
| 描述： | XFRMR BALUN RF 400-3000MHZ 0805 |
| 標準包裝： | 1 |
| 系列： | Xinger® |
| 頻率范圍： | 400MHz ~ 3GHz |
| 阻抗 - 不平衡/平衡： | 50 / 100 歐姆 |
| 相差： | 7° |
| 插入損耗（最大值）： | 4.0dB |
| 回程損耗（最小值）： | 8.4dB |
| 封裝/外殼： | 0805（2012 公制） |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標準包裝 |
| 其它名稱： | 1173-1052-6 |
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odel 0 30 0100 HF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
This component requires a 10 pF capacitor to be mounted in front of the unbalanced port (Pin 2) of the balun as
shown in the drawing below for optimum performance. The capacitor should be placed as close as possible to the
balun to minimize transmission line effects as shown in the suggested PCB footprint below.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
6x .41
6x .33
.04
4x .25
.66
3x
Plated thru
holes to ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
0402
Capacitor
3x Transmission
lines
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