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參數(shù)資料
| 型號： | B0205F50200AHF |
| 廠商： | Anaren |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 351K |
| 描述： | XFRMR BALUN RF 200-500MHZ 1608 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | Xinger® |
| 頻率范圍： | 200 ~ 500MHz |
| 阻抗 - 不平衡/平衡： | 50 / 200 歐姆 |
| 相差： | 1.3° |
| 插入損耗（最大值）： | 1.6dB |
| 回程損耗（最小值）： | 13.9dB |
| 封裝/外殼： | 1608（4121 公制） |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | 1173-1073-6 |
Visit us at
www.anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282
odel B0205F50 00AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
To supply common mode voltage offset to the analog-to-digital converter, DC blocking capacitors are
needed at the balanced port (pins 6 & 8).
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
Circuit Pattern
Footprint Pad (s)
Solder Resist
1.01 2x
4.02
.29 6x
.21 4x
.36 10x
.29 10x
3x
Transmission
Line
Plated thru
hole(s) to
Ground
1.66 2x
.89 4x
PART ORIENTATION (TOP VIEW)
Mounting Footprint
Dimensions are in Millimeters
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