參數(shù)資料
型號(hào): AX250-1FGG256
廠商: Microsemi SoC
文件頁(yè)數(shù): 157/262頁(yè)
文件大小: 0K
描述: IC FPGA AXCELERATOR 250K 256FBGA
標(biāo)準(zhǔn)包裝: 90
系列: Axcelerator
邏輯元件/單元數(shù): 2816
RAM 位總計(jì): 55296
輸入/輸出數(shù): 138
門數(shù): 250000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)當(dāng)前第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)第225頁(yè)第226頁(yè)第227頁(yè)第228頁(yè)第229頁(yè)第230頁(yè)第231頁(yè)第232頁(yè)第233頁(yè)第234頁(yè)第235頁(yè)第236頁(yè)第237頁(yè)第238頁(yè)第239頁(yè)第240頁(yè)第241頁(yè)第242頁(yè)第243頁(yè)第244頁(yè)第245頁(yè)第246頁(yè)第247頁(yè)第248頁(yè)第249頁(yè)第250頁(yè)第251頁(yè)第252頁(yè)第253頁(yè)第254頁(yè)第255頁(yè)第256頁(yè)第257頁(yè)第258頁(yè)第259頁(yè)第260頁(yè)第261頁(yè)第262頁(yè)
Detailed Specifications
2- 10
R e v i sio n 1 8
User-Defined Supply Pins
VREF
Supply Voltage
Reference voltage for I/O banks. VREF pins are configured by the user from regular I/O pins; VREF pins
are not in fixed locations. There can be one or more VREF pins in an I/O bank.
Global Pins
HCLKA/B/C/D
Dedicated (Hardwired) Clocks A, B, C and D
These pins are the clock inputs for sequential modules or north PLLs. Input levels are compatible with all
supported I/O standards. There is a P/N pin pair for support of differential I/O standards. Single-ended
clock I/Os can only be assigned to the P side of a paired I/O. This input is directly wired to each R-cell
and offers clock speeds independent of the number of R-cells being driven. When the HCLK pins are
unused, it is recommended that they are tied to ground.
CLKE/F/G/H
Routed Clocks E, F, G, and H
These pins are clock inputs for clock distribution networks or south PLLs. Input levels are compatible with
all supported I/O standards. There is a P/N pin pair for support of differential I/O standards. Single-ended
clock I/Os can only be assigned to the P side of a paired I/O. The clock input is buffered prior to clocking
the R-cells. When the CLK pins are unused, Microsemi recommends that they are tied to ground.
JTAG/Probe Pins
PRA/B/C/D
Probe A, B, C and D
The Probe pins are used to output data from any user-defined design node within the device (controlled
with Silicon Explorer II). These independent diagnostic pins can be used to allow real-time diagnostic
output of any signal path within the device. The pins’ probe capabilities can be permanently disabled to
protect programmed design confidentiality. The probe pins are of LVTTL output levels.
TCK
Test Clock
Test clock input for JTAG boundary-scan testing and diagnostic probe (Silicon Explorer II).
TDI
Test Data Input
Serial input for JTAG boundary-scan testing and diagnostic probe. TDI is equipped with an internal 10 k
Ω
pull-up resistor.
TDO
Test Data Output
Serial output for JTAG boundary-scan testing.
TMS
Test Mode Select
The TMS pin controls the use of the IEEE 1149.1 boundary-scan pins (TCK, TDI, TDO, TRST). TMS is
equipped with an internal 10 k
Ω pull-up resistor.
TRST
Boundary Scan Reset Pin
The TRST pin functions as an active-low input to asynchronously initialize or reset the boundary scan
circuit. The TRST pin is equipped with a 10 k
Ω pull-up resistor.
Special Functions
LP
Low Power Pin
The LP pin controls the low power mode of Axcelerator devices. The device is placed in the low power
mode by connecting the LP pin to logic high. To exit the low power mode, the LP pin must be set Low.
Additionally, the LP pin must be set Low during chip powering-up or chip powering-down operations. See
NC
No Connection
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
相關(guān)PDF資料
PDF描述
RMC60DRTN CONN EDGECARD 120PS DIP .100 SLD
RSC60DRTH CONN EDGECARD 120PS DIP .100 SLD
AX250-1FG256 IC FPGA AXCELERATOR 250K 256FBGA
5745172-2 CONN BACKSHELL DB15 DIE CAST
RMC60DRTH CONN EDGECARD 120PS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AX250-1FGG256I 功能描述:IC FPGA AXCELERATOR 250K 256FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Axcelerator 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
AX250-1FGG256M 制造商:Microsemi Corporation 功能描述:FPGA Axcelerator Family 154K Gates 2816 Cells 763MHz 0.15um Technology 1.5V 256-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA AXCELERATOR 154K GATES 2816 CELLS 763MHZ 0.15UM 1.5V 25 - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA AXCELERATOR 154K GATES 2816 CELLS 763MHZ 0.15UM 1.5V 25 - Trays
AX250-1FGG484 功能描述:IC FPGA AXCELERATOR 250K 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Axcelerator 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
AX250-1FGG484I 功能描述:IC FPGA AXCELERATOR 250K 484FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Axcelerator 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
AX250-1FGG484M 制造商:Microsemi Corporation 功能描述:FPGA AXCELERATOR 154K GATES 2816 CELLS 763MHZ 0.15UM 1.5V 48 - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 248 I/O 484FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA AXCELERATOR 250K 484FBGA