March 2012
i
2012 Microsemi Corporation
Axcelerator Family FPGAs
Leading-Edge Performance
350+ MHz System Performance
500+ MHz Internal Performance
High-Performance Embedded FIFOs
700 Mb/s LVDS Capable I/Os
Specifications
Up to 2 Million Equivalent System Gates
Up to 684 I/Os
Up to 10,752 Dedicated Flip-Flops
Up to 295 kbits Embedded SRAM/FIFO
Manufactured on Advanced 0.15
μm CMOS Antifuse Process
Technology, 7 Layers of Metal
Features
Single-Chip, Nonvolatile Solution
Up to 100% Resource Utilization with 100% Pin Locking
1.5 V Core Voltage for Low Power
Footprint Compatible Packaging
Flexible, Multi-Standard I/Os:
– 1.5 V, 1.8 V, 2.5 V, 3.3 V Mixed Voltage Operation
– Bank-Selectable I/Os – 8 Banks per Chip
– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V PCI,
and 3.3 V PCI-X
– Differential I/O Standards: LVPECL and LVDS
– Voltage-Referenced I/O Standards: GTL+, HSTL Class 1,
SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
– Registered I/Os
– Hot-Swap Compliant I/Os (except PCI)
– Programmable Slew Rate and Drive Strength on Outputs
– Programmable Delay and Weak Pull-Up/Pull-Down Circuits
on Inputs
Embedded Memory:
– Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4, x9, x18,
x36 Organizations Available)
– Independent, Width-Configurable Read and Write Ports
– Programmable Embedded FIFO Control Logic
Segmentable Clock Resources
Embedded Phase-Locked Loop:
– 14-200 MHz Input Range
– Frequency Synthesis Capabilities up to 1 GHz
Deterministic, User-Controllable Timing
Unique In-System Diagnostic and Debug Capability with
Microsemi Silicon Explorer II
Boundary-Scan Testing Compliant with IEEE Standard 1149.1
(JTAG)
FuseLock Programming Technology Protects Against
Reverse Engineering and Design Theft
Table 1 Axcelerator Family Product Profile
Device
AX125
AX250
AX500
AX1000
AX2000
Capacity (in Equivalent System Gates)
125,000
250,000
500,000
1,000,000
2,000,000
Typical Gates
82,000
154,000
286,000
612,000
1,060,000
Modules
Register (R-cells)
672
1,408
2,688
6,048
10,752
Combinatorial (C-cells)
1,344
2,816
5,376
12,096
21,504
Maximum Flip-Flops
1,344
2,816
5,376
12,096
21,504
Embedded RAM/FIFO
Number of Core RAM Blocks
4
12
16
36
64
Total Bits of Core RAM
18,432
55,296
73,728
165,888
294,912
Clocks (Segmentable)
Hardwired
4
Routed
4
PLLs
88
8
I/Os
I/O Banks
8
Maximum User I/Os
168
248
336
516
684
Maximum LVDS Channels
84
124
168
258
342
Total I/O Registers
504
744
1,008
1,548
2,052
Package
PQ
BG
FG
CQ
CG
256, 324
208
256, 484
208, 352
208
484, 676
208, 352
729
484, 676, 896
352
624
896, 1152
256, 352
624
Revision 18