參數(shù)資料
型號: AWT6275RM20P9
廠商: ANADIGICS INC
元件分類: 無繩電話/電話
英文描述: TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, BCC10
封裝: 4 X 4 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, SMT-10
文件頁數(shù): 1/8頁
文件大小: 393K
代理商: AWT6275RM20P9
11/2008
AWT6275
HELPTM IMT/WCDMA 3.4V/27.5dBm
Linear Power Amplifier Module
Data Sheet - Rev 2.2
FEATURES
InGaP HBT Technology
High Efficiency:
43% @ POUT = +27.5 dBm
21% @ POUT = +16 dBm
15% @ POUT = +7 dBm
Low Quiescent Current: 16 mA
Low Leakage Current in Shutdown Mode:<1 mA
VREF = +2.85 V (+2.75 V min over temp)
Optimized for a 50 V System
Low Profile Miniature Surface Mount Package
RoHS Compliant Package, 250 oC MSL-3
HSPA Capable
APPLICATIONS
WCDMA/HSPA IMT-Band Wireless Handsets
and Data Devices
PRODUCT DESCRIPTION
The AWT6275 meets the increasing demands for
higher output power in UMTS handsets. The PA
module is optimized for VREF = +2.85 V, a require-
ment for compatibility with the Qualcomm 6250
chipset. The device is manufactured on an ad-
vanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. Selectable bias modes that optimize
efficiency for different output power levels, and a
shutdown mode with low leakage current, increase
handset talk and standby time. The self-contained
4 mm x 4 mm x 1 mm surface mount package
incorporates matching networks optimized for output
power, efficiency, and linearity in a 50 V system.
Figure 1: Block Diagram
Bias Control
VCC
VREF
RFIN
RFOUT
GND
VMODE
1
7
5
8
10
6
GND at slug (pad)
3
9
4
2
GND
VCC
GND
AWT6275
M20 Package
10 Pin 4 mm x 4 mm x 1 mm
Surface Mount Module
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