參數(shù)資料
型號(hào): AWS5523D1
廠商: ANADIGICS INC
元件分類(lèi): 衰減器
英文描述: 0.5 to 2.5 GHz SP3T Switch
中文描述: 500 MHz - 2500 MHz RF/MICROWAVE SGL POLE TRIPLE THROW SWITCH, 0.8 dB INSERTION LOSS
封裝: DIE-12
文件頁(yè)數(shù): 6/8頁(yè)
文件大?。?/td> 123K
代理商: AWS5523D1
6
ADVANCED PRODUCT INFORMATION - Rev 0.2
04/2003
AWS5523
APPLICATION INFORMATION
Figure 8: Application Schematic
Die Applications
Bonding and circuit connections for the unpackaged
AWS5523 die are shown in Figure 8, and application
details are listed in the following notes:
1. Cb are DC blocking capacitors external to the
device. A value of 100pF is sufficient for operation to
500MHz. The values may be tailored to provide
specific electrical responses. The isolation of the switch
provides enough decoupling of RF ports 1 through 3
so that overall switch performance is not affected.
2. The VS1 and VS2 pins provide a fixed voltage
potential to the common port of the switch. To get the
best linear performance, either VS1 or VS2 must be
tied to the logic high voltage potential (not the power
supply). Only one of the pins need be attached, with
the decision determined by external circuit layout.
Currentdraw on this pin is less than 5
μ
A.
3. The RF Ground bondwires should be keep short as
possible and bonded directly to a good RF ground for
best broadband performance.
4. L
ESD
provides a means to increase the ESD
protection on a specific RF port, typically the port
attached to the antenna. The ESD rating of the device
is
±
125V HBM overall. This rating is associated with
the control pin to RF port path. RF port to RF port/RF
Gnd has been determined to be >
±
500V HBM for this
technology. By using L
ESD
as an RF choke on a port,
an ESD protection to
±
8kV contact discharge can be
achieved.
5. The die may be attached by either conductive or
non-conductive epoxy formulated for attaching
semiconductor parts. The back of the die is electrically
isolated from the switch circuit and can be grounded
or left isolated.
RFC
VS2
V3
RF3
RF3G
V2
RF2
RF2G
RF1G
RF1
V1
VS1
Common (Ant.) RF Port
Control Pin, RF Path 3
RF Port 3
RF Gnd, Path 3 Shunt
Control Pin, RF Path 2
Control Pin, RF Path 1
RF Gnd, Path 2 Shunt
RF Gnd, Path 1 Shunt
RF Port 2
RF Port 1
Common Port
Supply
Note 2 (Logic high)
C
b
C
b
C
b
C
b
L
ESD
Note 4
Keep RF Gnd Bondwires Short
3 Places, Note 3
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