參數(shù)資料
型號: AV60A-048L-033D025N-8-M1
元件分類: 電源模塊
英文描述: 2-OUTPUT 75 W DC-DC REG PWR SUPPLY MODULE
封裝: 61 X 57.90 MM, 12.7 MM HEIGHT, HALF BRICK PACKAGE-10
文件頁數(shù): 9/25頁
文件大?。?/td> 273K
代理商: AV60A-048L-033D025N-8-M1
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USA
Europe
Asia
TEL:
1-760-930-4600
44-(0)1384-842-211
852-2437-9662
FAX:
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www.astec.com
can vary greatly depending on the IR drops
along the leads and changes in the loads clos-
er to the source. Dynamic load conditions
increase the potential problems.
Radial Power Distribution
Radial power distribution is the preferred
method of providing power to the load. Figure
26 shows how individual loads are connected
directly to the power source. This arrangement
requires additional power leads, but it avoids
the voltage variation problems associated with
the parallel power distribution technique.
Mixed Distribution
In the real world a combination of parallel and
radial power distribution is often used. Dynamic
and high current loads are connected using a
radial design, while static and low current loads
can be connected in parallel. This combined
approach minimizes the drawbacks of a parallel
design when a purely radial design is not feasi-
ble.
Thermal Management
T
Technologies
echnologies
AV60A dual output series modules feature high
efficiency, the 5V/3.3 V output units have typical
efficiency of 82% at full load, and the 3.3V/2.5V
output units have typical efficiency of 80% at full
load. With less heat dissipation and tempera-
ture-resistant components such as ceramic
capacitors, these modules exhibit good behav-
ior during prolonged exposure to high tempera-
tures. Maintaining the operating case tempera-
ture (Tc) within the specified range help keep
internal-component temperatures within their
specifications which in turn help keep MTBF
from falling below the specified rating. Proper
cooling of the power modules is also necessary
for reliable and consistent operation.
Basic Thermal Management
Measuring the case temperature of the module
(Tc) as the method shown in Figure 28 can ver-
ify the proper cooling. Figure 28 shows the
metal surface of the module and the pin loca-
tions. The module should work under 90°C for
the reliability of operation and TC must not
exceed 100 °C while operating in the final sys-
tem configuration. The measurement can be
made with a surface probe after the module has
reached thermal equilibrium. If a heat sink is
mounted to the case, make the measurement
as close as possible to the indicated position. It
makes the assumption that the final system
configuration exists and can be used for a test
environment.
The following text and graphs show guidelines
to predict the thermal performance of the mod-
ule for typical configurations that include heat
sinks in natural or forced airflow environments.
Note that Tc of module must always be checked
Load 1
Load 2
Load 3
+Vout
-Vout
RL1
RL2
RL3
RG1
RG2
RG3
RL = Lead Resistance
RG = Ground Lead Resistance
Load 4
RL4
RG4
Fig.27 Mixed Power Distribution
Load 1
Load 2
Load 3
+Vout
-Vout
RL1
RL2
RL3
RG1
RG2
RG3
RL = Lead Resistance
RG = Ground Lead Resistance
Fig.26 Radial Power Distribution
Load 1
Load 2
Load 3
+Vout
-Vout
RL1
RL2
RL3
RG1
RG2
RG3
I1 + I2 + I3
I2 + I3
I3
RL = Lead Resistance
RG = Ground Lead Resistance
Fig.25 Parallel Power Distribution
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