參數(shù)資料
型號: AUIRFR6215TRR
元件分類: JFETs
英文描述: 13 A, 150 V, 0.295 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA
封裝: ROHS COMPLIANT, PLASTIC, DPAK-3
文件頁數(shù): 1/12頁
文件大小: 268K
代理商: AUIRFR6215TRR
AUIRFR6215
HEXFET Power MOSFET
PD-96302
Specifically designed for Automotive applications of
HEXFET Power MOSFETs utilizes the latest processing
techniques to achieve low on-resistance per silicon area.
This benefit combined with the fast switching speed and
ruggedized device design that HEXFET power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in Automotive and a
wide variety of other applications.
Description
Features
P-Channel
Low On-Resistance
Dynamic dV/dT Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
S
D
G
D-Pak
AUIRFR6215
S
D
G
D
AUTOMOTIVE GRADE
V(BR)DSS
-150V
RDS(on) max. 0.295:
ID
-13A
www.irf.com
1
HEXFET is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
04/13/10
GD
S
Gate
Drain
Source
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the
specifications is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
IDM
Pulsed Drain Current
ch
PD @TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
VGS
Gate-to-Source Voltage
V
EAS
Single Pulse Avalanche Energy (Thermally limited)
dh
mJ
IAR
Avalanche Current
ch
A
EAR
Repetitive Avalanche Energy
ch
mJ
dv/dt
Peak Diode Recovery
e
V/ns
TJ
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
hj
–––
1.4
RθJA
Junction-to-Ambient(PCB mount)
i
–––
50
°C/W
RθJA
Junction-to-Ambient
–––
110
Max.
-13
-9.0
-44
110
5.0
-55 to + 175
± 20
0.71
300
310
A
°C
-6.6
11
相關(guān)PDF資料
PDF描述
AUIRFR6215TR 13 A, 150 V, 0.295 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA
AUIRFR6215TRL 13 A, 150 V, 0.295 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA
AUIRFR9024NTRL 11 A, 55 V, 0.175 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA
AUIRFU9024N 11 A, 55 V, 0.175 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-251AA
AUIRFR9024NTR 11 A, 55 V, 0.175 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-252AA
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