參數(shù)資料
型號: AUIRF1018ESTRR
元件分類: JFETs
英文描述: 79 A, 60 V, 0.0084 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
封裝: ROHS COMPLIANT, PLASTIC, D2PAK-3
文件頁數(shù): 1/11頁
文件大小: 243K
代理商: AUIRF1018ESTRR
08/19/11
www.irf.com
1
HEXFET Power MOSFET
PD - 97711
AUIRF1018ES
VDSS
60V
RDS(on) typ.
7.1m
:
max.
8.4m
:
ID
79A
AUTOMOTIVE GRADE
Description
Specifically designed for Automotive applications, this
HEXFET Power MOSFET utilizes the latest processing
techniques to achieve extremely low on-resistance per silicon
area. Additional features of this design are a 175°C junction
operating temperature, fast switching speed and improved
repetitive avalanche rating . These features combine to make
this design an extremely efficient and reliable device for use in
Automotive applications and a wide variety of other applications.
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only;
and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are
measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
HEXFET is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
S
D
G
GD
S
Gate
Drain
Source
D2Pak
IRF1018ESPbF
S
D
G
D
Symbol
Parameter
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
A
IDM
Pulsed Drain Current
c
PD @TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
VGS
Gate-to-Source Voltage
V
EAS
Single Pulse Avalanche Energy (Thermally limited) d
mJ
IAR
Avalanche Current c
A
EAR
Repetitive Avalanche Energy f
mJ
dv/dt
Peak Diode Recovery
e
V/ns
TJ
Operating Junction and
°C
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Thermal Resistance
Symbol
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case j
–––
1.32
RθJA
Junction-to-Ambient (PCB Mount) , D2Pak
i
–––
40
88
47
11
110
°C/W
300
21
-55 to + 175
± 20
0.76
Max.
79
56
315
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