參數(shù)資料
型號(hào)： AT24C04Y6-10YH-1.8
廠商： ATMEL CORP
元件分類(lèi)： DRAM
英文描述： Two-wire Serial EEPROM
中文描述： 512 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8
封裝： 2 X 3 MM, 0.50 MM PITCH, GREEN, MO-229, MLP-8
文件頁(yè)數(shù)： 23/26頁(yè)
文件大?。?/td> 617K
代理商： AT24C04Y6-10YH-1.8
23
AT24C01A/02/04/08A/16A
0180Z–SEEPR–11/06
5TS1 – SOT23
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
5TS1,
5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
DRAWING NO.
R
REV.
PO5TS1 A
6/25/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A
–
–
1.10
A1
0.00
–
0.10
A2
0.70
0.90
1.00
c
0.08
–
0.20
4
D
2.90 BSC
2, 3
E
2.80 BSC
2, 3
E1
1.60 BSC
2, 3
L1
0.60 REF
e
0.95 BSC
e1
1.90 BSC
b
0.30
–
0.50
4, 5
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
shall not be less than 0.07 mm.
5
4
2
L1
L
C
End View
C
A
A2
A1
b
e
Seating
Plane
D
Side View
e1
E1
3
1
Top View
E
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