參數(shù)資料
型號: AT-32033-TR1
英文描述: Low Current, High Performance NPN Silicon Bipolar Transistor
中文描述: 低電流,高性能NPN硅雙極晶體管
文件頁數(shù): 1/10頁
文件大?。?/td> 125K
代理商: AT-32033-TR1
4-53
Low Current, High Performance
NPN Silicon Bipolar Transistor
Technical Data
Features
High Performance Bipolar
Transistor Optimized for
Low Current, Low Voltage
Operation
900 MHz Performance:
AT-32011: 1 dB NF, 14 dB G
A
AT-32033: 1 dB NF, 12.5 dB G
A
Characterized for End-Of-
Life Battery Use (2.7 V)
SOT-23 and SOT-143 SMT
Plastic Packages
Tape-And-Reel Packaging
Option Available
[1]
Description
Hewlett Packard’s AT-32011 and
AT-32033 are high performance
NPN bipolar transistors that have
been optimized for maximum f
t
at
low voltage operation, making
them ideal for use in battery
powered applications in wireless
markets. The AT-32033 uses the
3lead SOT-23, while the AT-320 11
places the same die in the higher
performance 4 lead SOT-143. Both
packages are industry standard,
and compatible with high volume
surface mount assembly
techniques.
The 3.2 micron emitter-to-emitter
pitch and reduced parasitic design
of these transistors yields
extremely high performance
products that can perform a
multiplicity of tasks. The
20emitter finger interdigitated
geometry yields an easy to match
to and extremely fast transistor
with moderate power, low noise
resistance, and low operating
currents.
Optimized performance at 2.7 V
makes these devices ideal for use
in 900 MHz, 1.8 GHz, and 2.4 GHz
battery operated systems as an
LNA, gain stage, buffer, oscillator,
or active mixer. Typical amplifier
designs at 900 MHz yield 1.2 dB
noise figures with 12 dB or more
associated gain at a 2.7 V, 2 mA
bias, with noise performance
being relatively insensitive to
input match. High gain capability
at 1 V, 1 mA makes these devices a
good fit for 900 MHz pager
applications. Voltage breakdowns
are high enough for use at 5 volts.
The AT-3 series bipolar transistors
are fabricated using an optimized
version of Hewlett Packard’s
10GHz f
t
, 30 GHz f
MAX
Self-
Aligned-Transistor (SAT) process.
The die are nitride passivated for
surface protection. Excellent
device uniformity, performance
and reliability are produced by the
use of ion-implantation, self-
alignment techniques, and gold
metalization in the fabrication of
these devices.
AT-32011
AT-32033
BASE
EMITTER
EMITTER COLLECTOR
BASE
EMITTER
COLLECTOR
320
320
SOT-23 (AT-32033)
SOT-143 (AT-32011)
Note:
1. Refer to “Tape-and-Reel Packaging for Semiconductor Devices.”
Outline Drawing
5965-8920E
相關(guān)PDF資料
PDF描述
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