參數(shù)資料
型號: AS1751V-T
廠商: AUSTRIAMICROSYSTEMS AG
元件分類: 數(shù)據(jù)轉(zhuǎn)換
英文描述: Quad 0.9Ω SPST Switch; Package Type: TQFN(3x3)-16
中文描述: 高速,低電壓,單電源,0.9ヘ,四路SPST模擬開關(guān)
封裝: TQFN(3x3)-16
文件頁數(shù): 3/16頁
文件大?。?/td> 517K
代理商: AS1751V-T
www.austriamicrosystems.com
Revision 1.41
3 - 16
AS1751/AS1752/AS1753
Data Sheet
- Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
Electrical Character-
istics on page 4
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Signals on pins COM1, COM3, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes. For-
ward-diode current should be limited to the maximum current rating.
Table 2. Absolute Maximum Ratings
Parameter
V+, IN
x
to GND
Min
-0.3
Max
+5
V+
+ 0.3
+250
+350
727
1349
+85
2500
250
+150
+150
Units
V
Comments
COM
x
, NO
x
, NC
x
to GND
-0.3
V
COM
x
, NO
x
, NC
x
Continuous Current
COM
x
, NO
x
, NC
x
Peak Current
-250
-350
mA
mA
Pulsed at 1ms 10% duty cycle
Derate at 9.1W/oC above +70oC
Derate at 16.9W/oC above +70oC
Continuous Power
Dissipation (T
AMB
= +70oC)
16-pin TQFN
14-pin TSSOP
mW
Operating Temperature Range
Electro-Static Discharge
Latch Up Immunity
Junction Temperature
Storage Temperature Range
-40
oC
V
mA
oC
oC
HBM Mil-Std883E 3015.7
methods
Norm:
JEDEC 17
-65
Package Body Temperature
+260
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”
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