參數(shù)資料
型號(hào): AS1747-BTDT-1K
廠商: ams
文件頁(yè)數(shù): 13/17頁(yè)
文件大?。?/td> 0K
描述: IC SWITCH DUAL SPDT 10TDFN
標(biāo)準(zhǔn)包裝: 1
功能: 音頻開(kāi)關(guān)
電路: 2 x SPDT
導(dǎo)通狀態(tài)電阻: 850 毫歐
電壓電源: 單電源
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.5 V
電流 - 電源: 10nA
工作溫度: -40°C ~ 85°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 10-WFDFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 10-TDFN(3x3)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱(chēng): AS1747-BTDT-1KDKR
Revision 1.02
4 - 16
AS1747, AS1748, AS1749, AS1750
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
VCC, IN_, CMP-
-0.3
+6.0
V
COM_, NO_, NC_
VCC - 6
VCC +
0.3
V
CMPO
0.3
VCC +
0.3
V
Closed-Switch Continuous Current COM_,
NO_, NC_
±150
mA
Open-Switch Continuous Current NO_, NC_
(AS1749/AS1750)
±30
mA
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)
±400
mA
Continuous Power Dissipation (TA = +70C)
10-pin TDFN 3x3
(derate 24.4mW/C above +70C)
1951
mW
12-Bump WL-CSP (AS1747/AS1749)
(derate 5.6mW/C above +70C)
449
mW
12-Bump WL-CSP (AS1748/AS1750)
(derate 6.5mW/C above +70C)
519
mW
16-pin TQFN 3x3
(derate 16.9mW/C above +70C)
1349
mW
ESD
2kV
HBM MIL-Std. 883E 3015.7 methods
Latchup Immunity
-200
+200
mA
@25°C, JEDEC 78
Operating Temperature Range
-40
+85
C
Junction Temperature
+150
C
Storage Temperature Range
-65
+150
C
Package Body Temperature
+260
C
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-
020D “Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
ams
AG
Technical
content
still
valid
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