參數(shù)資料
型號(hào): AS1746-BTDT
廠商: AUSTRIAMICROSYSTEMS AG
元件分類(lèi): 數(shù)據(jù)轉(zhuǎn)換
英文描述: Dual, SPDT Switch; Package Type: TDFN(3x3)-10
封裝: TDFN(3x3)-10
文件頁(yè)數(shù): 3/15頁(yè)
文件大?。?/td> 481K
代理商: AS1746-BTDT
www.austriamicrosystems.com
Revision 1.03
3 - 15
AS1746
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 2
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
Electrical Character-
istics on page 4
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 2. Absolute Maximum Ratings
Parameter
V+, IN
x
to GND
Min
-0.3
Max
+7
Units
V
Comments
COM
x
, NO
x
, NC
x
, to GND
-0.3
V+ +
0.3
V
COM
x
, NO
x
, NC
x
signals exceeding V+ or GND
are internally clamped by diodes and forward-
diode current must be limited to the maximum
current rating.
COM
x
, NO
x
, NC
x
Continuous Current
COM
x
, NO
x
, NC
x
Peak Current
COM
x
, NO
x
, NC
x
Peak Current
Continuous Power Dissipation
Electro-Static Discharge
Latchup Immunity
Operating Ambient
Temperature Range
Storage Temperature Range
-300
+300
mA
-400
+400
mA
Pulsed at 50% duty cycle
-500
+500
mA
Pulsed at 10% duty cycle
444
mW
kV
mA
T
AMB
= +70oC
2.5
HBM Mil-Std883E 3015.7
methods
Class II, Level A
250
-40
+85
oC
-65
+150
oC
Package Body Temperature
+260
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
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