參數(shù)資料
型號(hào): AS1524-BTDT
廠商: AUSTRIAMICROSYSTEMS AG
元件分類: ADC
英文描述: μPower 12-Bit 1-CH 150ksps TD; Package Type: TDFN(3x3)-8
封裝: TDFN(3x3)-8
文件頁數(shù): 4/22頁
文件大?。?/td> 706K
代理商: AS1524-BTDT
www.austriamicrosystems.com
Revision 1.02
4 - 22
AS1524/AS1525
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in
Table 3
may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in
Electrical Character-
istics on page 5
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VDD to GND
Min
-0.3
Max
+6
V
DD
+
0.3
50
Units
V
Comments
CNVST, SCLK, DOUT, REF, AIN1/
AIN+, AIN2/AIN- to GND
Current into Any Pin
Continuous Power Dissipation
Operating Temperature Range
Storage Temperature Range
-0.3
V
mA
mW
oC
oC
1491
-40
-60
T
AMB
= +70oC; derate 19.5mW/oC above +70oC
+85
+150
Package Body Temperature
+260
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
相關(guān)PDF資料
PDF描述
AS1526-BSOT 10-bit ADC 1-CH, 73ksps intRef; Package Type: SOIC-8
AS1527-BSOT 10-bit ADC, 1-Channel, 73ksps; Package Type: SOIC-8
AS1528-BTDT μPower 10-Bit 1-CH 150ksps TD; Package Type: TDFN(3x3)-8
AS1529-BTDT μPower 10-Bit 2-CH 150ksps SE; Package Type: TDFN(3x3)-8
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