
8
Data Sheet - Rev 2.0
07-2001
ARA1400/ARA1400I
APPLICATION INFORMATION
Amplifier Enable / Disable
The ARA1400 and the ARA1400I include two
amplification stages that each can be shut down
through external control pins VREF1 and VREF2 (pins 5
and 18, respectively.) By applying a typical bias of
1.75 Volts to these pins, the amplifiers are enabled.
In order to fully disable an amplifier, its control pin
requires a negative bias of -1.5 to -2.0 Volts.
Output Switch Control
A switch located at the output of Amplifier A2 in the
ARA1400 and the ARA1400I provides isolation
without having to disable the amplifiers. The switch
is controled by the Tx logic input (pin 25.)
Amplifier Bias Current
The ISET pins (11 and 27) set the bias current for the
amplification stages. Grounding these pins results
in the maximum possible current. By placing a
resistor from the pin to ground, the current can be
reduced. The recommended bias conditions use
the configuration shown in the test circuit schematic
in Figure 4.
Thermal Layout Considerations
The device package for the ARA1400 and the
ARA1400I features a heat slug on the bottom of the
package body. Use of the heat slug is an integral
part of the device design. Soldering it to the ground
plane of the PC board will ensure the lowest possible
thermal resistance for the device, and will result in
the longest MTF (mean time to failure.)
A PC board layout that optimizes the benefits of the
heat slug is shown in Figure 5. The via holes located
under the body of the device must be plated through
to a ground plane layer of metal, in order to provide
sufficient thermal conductivity. The recommended
solder mask outline is shown in Figure 6.
ESD Sensitivity
Electrostatic discharges can cause permanent
damage to these devices. Electrostatic charges
accumulate on test equipment and the human body,
and can discharge without detection. Proper
precautions
and
handling
are
strongly
recommended. Refer to the ANADIGICS application
note on ESD precautions.
Figure 5: PC Board Layout