
HS SOP 1 Form A (AQY2)
11. Packing format
1) Tape and reel
mm inch
Tape dimensions
Dimensions of paper tape reel
(1) When picked from 1/2-pin side: Part No. AQY23
SX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY23
SZ
7. Cleaning
We recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
Frequency: 27 to 29 kHz
Ultrasonic output:
No greater than 0.25W/cm2
Cleaning time: No longer than 30 s
Cleanser used: Asahiklin AK-225
Other:
Submerge in solvent in order to prevent
the PC board and elements from being
contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
8. Notes for mounting
1) If many different packages are
combined on a single substrate, then
lead temperature rise is highly dependent
on package size. For this reason, please
make sure that the temperature of the
terminal solder area of the PhotoMOS
relay falls within the temperature
conditions of item 10 before mounting.
2) If the mounting conditions exceed the
recommended solder conditions in item
10, resin strength will fall and the
nonconformity of the heat expansion
coefcient of each constituent material
will increase markedly, possibly causing
cracks in the package, severed bonding
wires, and the like. For this reason,
please inquire with us about whether this
use is possible.
3) We recommend cleaning with an
organic solvent.
If you cannot avoid using ultrasonic
cleaning, check beforehand for defects.
9. Input wiring pattern
With AQY series avoid installing the input
(LED side) wiring pattern to the bottom
side of the package if you require the
specied I/O isolation voltage (Viso) after
mounting the PC board. Since part of the
frame on the output side is exposed, it
may cause uctuations in the I/O isolation
voltage.
10. Soldering
Example of recommended soldering
conditions
(1) IR (Infrared reow) soldering method
(2) Soldering iron method
Tip temperature: 350 to 400
°C 662 to
752
°F
Wattage: 30 to 60 W
Soldering time: within 3 s
(3) Others
Check mounting conditions before using
other soldering methods (DWS, VPS, hot-
air, hot plate, laser, pulse heater, etc.)
When using lead-free solder, we
recommend a type with an alloy
composition of Sn 3.0 Ag 0.5 Cu. Please
inquire about soldering conditions and
other details.
The temperature prole indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
Portion of output side frame
(Output terminal side)
(Input terminal side)
May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
Input wiring
pattern
T1
T2
T3
T1 = 150 to 180
°C
T2 = 230
°C
T3 = 245
°C
t1 = 60 to 120 s or less
t2 = 30 s or less
t1
t2
302 to 356
°F
446
°F
or less
473
°F
0.3
±0.05
Tractor feed holes
Direction of picking
7.2
±0.1
1.75
±0.1
1.55
±0.05 dia.
2.8
±0.3
Device mounted
on tape
5.5
±0.1
4.7
±0.1 12±0.1
1.55
±0.1 dia.
4
±0.1
2
±0.1
12
±0.3
.012
±.002
.284
±.004
.069
±.004
.061
±.002 dia.
.110
±.012
.217
±.004
.185
±.004.472±.004
.061
±.004 dia.
.157
±.004
.079
±.004
.472
±.012
21±0.8
80±1 dia.
2±0.5
13±0.5 dia.
14±1.5
2±0.5
250±2 dia.
80±1 dia.
.827±.031
3.150±.039 dia.
.079±.020
.512±.020 dia.
.551±.059
.079±.020
9.843±.079 dia.
3.150±.039 dia.
2) Tube
Devices are packaged in a tube so that
pin No. 1 is on the stopper B side.
Observe correct orientation when
mounting them on PC boards.
Stopper B (green)
Stopper A (gray)
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