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參數(shù)資料
| 型號： | APL5332KAC-TR |
| 廠商： | Anpec Electronics Corporation |
| 英文描述： | Silver Mica Capacitor; Capacitance:960pF; Capacitance Tolerance:+/- 1%; Series:CD19; Voltage Rating:500VDC; Capacitor Dielectric Material:Mica; Termination:Radial Leaded; Lead Pitch:8.7mm; Leaded Process Compatible:No RoHS Compliant: No |
| 中文描述： | CMOS低壓與源庫 |
| 文件頁數(shù)： | 15/17頁 |
| 文件大?。?/td> | 161K |
| 代理商： | APL5332KAC-TR |
Copyright
ANPEC Electronics Corp.
Rev. A.3 - Oct., 2003
APL5332
www.anpec.com.tw
15
Physical S pecifications
Reference JEDEC Standard J-STD-020A APRIL 1999
Reflow Condition
(IR/Convection or VPR Reflow)
Pre-heat temperature
183 C
Peak temperature
Time
t
Classification Reflow Profiles
Convection or IR/
Convection
3
°
C/second max.
120 seconds max
60 – 150 seconds
VPR
Average ramp-up rate(183
°
C to Peak)
Preheat temperature 125 ± 25
°
C)
Temperature maintained above 183
°
C
Time within 5
°
C of actual peak temperature 10 –20 seconds
Peak temperature range
Ramp-down rate
Time 25
°
C to peak temperature
10
°
C /second max.
60 seconds
215-219
°
C or 235 +5/-0
°
C
10
°
C /second max.
220 +5/-0
°
C or 235 +5/-0
°
C
6
°
C /second max.
6 minutes max.
Package Reflow Conditions
pkg. thickness
≥
2.5mm
and all bgas
Convection
220 +5/-0
°
C
VPR 215-219
°
C
IR/Convection 220 +5/-0
°
C
pkg. thickness < 2.5mm and
pkg. volume
≥
350 mm3
pkg. thickness < 2.5mm and pkg.
volume < 350mm3
Convection 235 +5/-0
°
C
VPR 235 +5/-0
°
C
IR/Convection 235 +5/-0
°
C
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
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