參數(shù)資料
型號(hào)： APDS-9002-021
英文描述： Miniature Surface-Mount Ambient Light Photo Sensor
中文描述： 微型表面貼裝環(huán)境亮度傳感器
文件頁(yè)數(shù)： 9/16頁(yè)
文件大?。?/td> 212K
代理商： APDS-9002-021
9
Recommended Reflow Profile
Process Zone
Symbol
D
T
25
°
C to 160
°
C
160
°
C to 200
°
C
200
°
C to 255
°
C (260
°
C at 10 seconds max.)
255
°
C to 200
°
C
200
°
C to 25
°
C
Maximum
D
T/
D
Time
4
°
C/s
0.5
°
C/s
4
°
C/s
-6
°
C/s
-6
°
C/s
Heat Up
P1, R1
Solder Paste Dry
P2, R2
Solder Reflow
P3, R3
P3, R4
Cool Down
P4, R5
The reflow profile is a straight-
line representation of a nominal
temperature profile for a
convective reflow solder process.
The temperature profile is divided
into four process zones, each with
different
D
T/
D
time temperature
change rates. The
D
T/
D
time rates
are detailed in the above table.
The temperatures are measured
at the component to printed
circuit board connections.
In
process zone P1
, the PC board
and APDS-9002 castellation pins
are heated to a temperature of
160
°
C to activate the flux in the
solder paste. The temperature
ramp up rate, R1, is limited to 4
°
C
per second to allow for even
heating of both the PC board and
APDS-9002 castellations.
Process zone P2
should be of
sufficient time duration (60 to 120
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 200
°
C
(392
°
F).
Process zone P3
is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 255
°
C (491
°
F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 20 and 60 seconds. It
usually takes about 20 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 60 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 200
°
C (392
°
F), to allow
the solder within the connections
to freeze solid.
Process zone P4
is the cool down
after solder freeze. The cool down
rate, R5, from the liquidus point
of the solder to 25
°
C (77
°
F)
should not exceed 6
°
C per second
maximum. This limitation is
necessary to allow the PC board
and APDS-9002 castellations to
change dimensions evenly,
putting minimal stresses on the
APDS-9002.
0
t-TIME (SECONDS)
T
–
–
°
C
230
220
200
180
160
120
80
50
150
100
200
250
300
255
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3
R4
R5
60 sec.
MAX.
ABOVE
220
°
C
MAX. 260
°
C
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
APDS-9003 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Miniature Surface-Mount Ambient Light Photo Sensor
APDS-9003-020 功能描述:環(huán)境光傳感器 Ambient Light sensor RoHS:否 制造商:Vishay Semiconductors 工作電源電壓: 峰值波長(zhǎng):570 nm 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:T-1 封裝:Bulk
APDS-9003-022 功能描述:環(huán)境光傳感器 Ambient Light sensor RoHS:否 制造商:Vishay Semiconductors 工作電源電壓: 峰值波長(zhǎng):570 nm 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:T-1 封裝:Bulk
APDS-9004 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:Miniature Surface-Mount Ambient Light Photo Sensor
APDS-9004-020 功能描述:環(huán)境光傳感器 Ambient Light sensor RoHS:否 制造商:Vishay Semiconductors 工作電源電壓: 峰值波長(zhǎng):570 nm 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:T-1 封裝:Bulk
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