ProASICPLUS Flash Family FPGAs 2- 22 v5.9 Note: Each RAM block contains a mul" />
參數(shù)資料
型號: APA600-FG256
廠商: Microsemi SoC
文件頁數(shù): 105/178頁
文件大?。?/td> 0K
描述: IC FPGA PROASIC+ 600K 256-FBGA
標準包裝: 90
系列: ProASICPLUS
RAM 位總計: 129024
輸入/輸出數(shù): 186
門數(shù): 600000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
ProASICPLUS Flash Family FPGAs
2- 22
v5.9
Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not
consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when
RAM blocks are cascaded and are automatically inserted by the software tools.
Figure 2-18 Example SRAM Block Diagrams
Table 2-14 Memory Block SRAM Interface Signals
SRAM Signal
Bits
In/Out
Description
WCLKS
1
In
Write clock used on synchronization on write side
RCLKS
1
In
Read clock used on synchronization on read side
RADDR<0:7>
8
In
Read address
RBLKB
1
In
Read block select (active Low)
RDB
1
In
Read pulse (active Low)
WADDR<0:7>
8
In
Write address
WBLKB
1
In
Write block select (active Low)
DI<0:8>
9
In
Input data bits <0:8>, <8> can be used for parity In
WRB
1
In
Write pulse (active Low)
DO<0:8>
9
Out
Output data bits <0:8>, <8> can be used for parity out
RPE
1
Out
Read parity error (active High)
WPE
1
Out
Write parity error (active High)
PARODD
1
In
Selects odd parity generation/detect when High, even parity when Low
Note: Not all signals shown are used in all modes.
SRAM
(256x9)
DI <0:8>
DO <0:8>
RADDR <0:7>
WADDR <0:7>
WRB
RDB
WBLKB
RBLKB
WCLKS
RCLKS
RPE
PARODD
DI <0:8>
WADDR <0:7>
WRB
WBLKB
PARODD
WPE
SRAM
(256x9)
DI <0:8>
DO <0:8>
WADDR <0:7>
WRB
RDB
WBLKB
RBLKB
WCLKS
RPE
PARODD
WPE
RADDR <0:7>
PARODD
DI <0:8>
DO <0:8>
RADDR <0:7>
WADDR <0:7>
WRB
RDB
WBLKB
RBLKB
RCLKS
RPE
WPE
DO <0:8>
RADDR <0:7>
RDB
RBLKB
RCLKS
RPE
Sync Write
and
Sync Read
Ports
Async Write
and
Async Read
Ports
Sync Write
and
Async Read
Ports
Async Write
and
Sync Read
Ports
SRAM
(256x9)
SRAM
(256x9)
相關(guān)PDF資料
PDF描述
AX1000-1FG676 IC FPGA AXCELERATOR 1M 676-FBGA
EP20K300EQC240-3 IC APEX 20KE FPGA 300K 240-PQFP
EP4CGX110CF23C7 IC CYCLONE IV FPGA 110K 484FBGA
AX500-2FGG676I IC FPGA AXCELERATOR 500K 676FBGA
AX500-2FG676I IC FPGA AXCELERATOR 500K 676FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
APA600-FG256A 功能描述:IC FPGA PROASIC+ 600K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
APA600-FG256I 功能描述:IC FPGA PROASIC+ 600K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
APA600-FG256IX95 制造商:Microsemi Corporation 功能描述:
APA600-FG256M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 256-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays 制造商:Microsemi SOC Products Group 功能描述:FPGA PROASICPLUS 600K GATES 180MHZ 0.22UM 2.5V 256FBGA - Trays
APA600-FG484 功能描述:IC FPGA PROASIC+ 600K 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASICPLUS 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)