ProASICPLUS Flash Family FPGAs v5.9 2-27 Package Thermal Characteristics
參數資料
型號： APA450-FGG144A
廠商： Microsemi SoC
文件頁數： 110/178頁
文件大?。?/td> 0K
描述： IC FPGA PROASIC+ 450K 144-FBGA
標準包裝： 160
系列： ProASICPLUS
RAM 位總計： 110592
輸入/輸出數： 100
門數： 450000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 144-LBGA
供應商設備封裝： 144-FPBGA（13x13）
ProASICPLUS Flash Family FPGAs
v5.9
2-27
Package Thermal Characteristics
The ProASICPLUS family is available in several package
types with a range of pin counts. Actel has selected
packages based on high pin count, reliability factors, and
superior thermal characteristics.
Thermal resistance defines the ability of a package to
conduct heat away from the silicon, through the
package to the surrounding air. Junction-to-ambient
thermal resistance is measured in degrees Celsius/Watt
and is represented as Theta ja
(Θja). The lower the
thermal resistance, the more efficiently a package will
dissipate heat.
A package’s maximum allowed power (P) is a function of
maximum junction temperature (TJ), maximum ambient
operating temperature (TA), and junction-to-ambient
thermal resistance Θja. Maximum junction temperature is
the maximum allowable temperature on the active
surface of the integrated circuit (IC) and is 110°C. P is
defined as shown in
EQ 2-4
Θ
ja is a function of the rate (in linear feet per minute
(lfpm)) of airflow in contact with the package. When the
estimated power consumption exceeds the maximum
allowed power, other means of cooling, such as
increasing the airflow rate, must be used. The maximum
power dissipation allowed for a Military temperature
device is specified as a function of Θjc. The absolute
maximum junction temperature is 150°C.
The calculation of the absolute maximum power
dissipation
allowed
for
a
Military
temperature
application is illustrated in the following example for a
456-pin PBGA package:
EQ 2-5
P
T
J
T
A
–
Θ
ja
-----------------
=
Table 2-16 Package Thermal Characteristics
Plastic Packages
Pin Count
θ
jc
θ
ja
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14.0
33.5
27.4
25.0
°C/W
Thin Quad Flat Pack (TQFP)
144
11.0
33.5
28.0
25.7
°C/W
Plastic Quad Flat Pack (PQFP)1
208
8.0
26.1
22.5
20.8
°C/W
PQFP with heat spreader2
208
3.8
16.2
13.3
11.9
°C/W
Plastic Ball Grid Array (PBGA)
456
3.0
15.6
12.5
11.6
°C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)3
484
3.2
18.0
14.7
13.6
°C/W
Fine Pitch Ball Grid Array (FBGA)4
484
3.2
20.5
17.0
15.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
676
3.2
16.4
13.0
12.0
°C/W
Fine Pitch Ball Grid Array (FBGA)
896
2.4
13.6
10.4
9.4
°C/W
Fine Pitch Ball Grid Array (FBGA)
1152
1.8
12.0
8.9
7.9
°C/W
Ceramic Quad Flat Pack (CQFP)
208
2.0
22.0
19.8
18.0
°C/W
Ceramic Quad Flat Pack (CQFP)
352
2.0
17.9
16.1
14.7
°C/W
Ceramic Column Grid Array (CCGA/LGA)
624
6.5
8.9
8.5
8.0
°C/W
Notes:
1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300
2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000
3. Depopulated array
4. Full array
Maximum Power Allowed
Max. junction temp. (
°C) Max. case temp. (°C)
–
θ
jc(°C/W)
-----------------------------------------------------------------------------------------------------------------------------
150
°C125°C
–
3.0
°C/W
----------------------------------------
8.333W
=
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相關代理商/技術參數
參數描述
APA450-FGG144I 功能描述:IC FPGA PROASIC+ 450K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數:9360 邏輯元件/單元數:149760 RAM 位總計:6635520 輸入/輸出數:270 門數:- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
APA450-FGG256 功能描述:IC FPGA PROASIC+ 450K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數:9360 邏輯元件/單元數:149760 RAM 位總計:6635520 輸入/輸出數:270 門數:- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
APA450-FGG256A 功能描述:IC FPGA PROASIC+ 450K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數:9360 邏輯元件/單元數:149760 RAM 位總計:6635520 輸入/輸出數:270 門數:- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
APA450-FGG256I 功能描述:IC FPGA PROASIC+ 450K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數:9360 邏輯元件/單元數:149760 RAM 位總計:6635520 輸入/輸出數:270 門數:- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
APA450-FGG484 功能描述:IC FPGA PROASIC+ 450K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:ProASICPLUS 產品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數:9360 邏輯元件/單元數:149760 RAM 位總計:6635520 輸入/輸出數:270 門數:- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應商設備封裝:484-FBGA（23x23）
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