
^lwNMNQ
The strategy for choosing R
and C
is to set the cross
over frequency with R
and set the compensator zero
with C
. Using selected crossover frequency, f
C
, to
calculate R
C
:
V
f
R
×
=
February 2006
www.aosmd.com
Page 13 of 21
CS
EA
O
FB
O
C
C
G
G
C
V
×
×
×
π
2
where f
is desired crossover frequency;
V
FB
is 0.8V;
G
is the error amplifier transconductance,
which is 20010
G
is the current sense circuit
transconductance, which is 9.02 A/V;
The compensation capacitor C
and resistor R
together
make a zero. This zero is put somewhere close to the
dominate pole f
but lower than 1/5 of selected
crossover frequency. C
C
can is selected by:
-6
A/V;
1
2
5
R
×
π
p
C
C
f
C
×
=
Equation above can also be simplified to:
C
L
O
C
R
R
C
C
×
=
An easy-to-use application software which helps to
design and simulate the compensation loop can be
found at www.aosmd.com.
Thermal management and layout consideration
In the AOZ1014 buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the VIN pin, to the LX
pins, to the filter inductor, to the output capacitor and
load, and then return to the input capacitor through
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the
output capacitors and load, to the anode of Schottky
diode, to the cathode of Schottky diode. Current flows in
the second loop when the low side diode is on.
In PCB layout, minimizing the two loops area reduces
the noise of this circuit and improves efficiency. A
ground plane is strongly recommended to connect input
capacitor, output capacitor, and PGND pin of the
AOZ1014.
In the AOZ1014 buck regulator circuit, the major power
dissipating components are the AOZ1014, the Schottky
diode and output inductor. The total power dissipation of
converter circuit can be measured by input power minus
output power.
I
V
P
=
_
The power dissipation in Schottky can be approximated
as:
O
loss
diode
I
P
_
1
=
Where V
FW_Schottky
is the Schottky diode forward voltage
drop.
The power dissipation of inductor can be approximately
calculated by output current and DCR of inductor.
_
=
O
loss
indcutor
R
I
P
The actual junction temperature can be calculated with
power dissipation in the AOZ1014 and thermal
impedance from junction to ambient.
P
P
T
=
(
_
_
The maximum junction temperature of AOZ1014 is
150oC, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1014 under different ambient
temperature.
The thermal performance of the AOZ1014 is strongly
affected by the PCB layout. Extra care should be taken
by users during design process to ensure that the IC will
operate
under
the
recommended
conditions.
The AOZ1014A is standard SO-8 package. The
AOZ1014D is a thermally enhanced DFN package,
which utilizes the exposed thermal pad at the bottom to
spread heat through PCB metal. Several layout tips are
listed below for the best electric and thermal
performance. Figure 3 below illustrates a PCB layout
example of AOZ1014A. Figure 4 below illustrates a PCB
layout example of AOZ1014D.
2. Do not use thermal relief connection to the VIN and
the PGND pin. Pour a maximized copper area to the
PGND pin and the VIN pin to help thermal
dissipation.
3. Input capacitor should be connected to the VIN pin
and the PGND pin as close as possible.
4. A ground plane is preferred. If a ground plane is not
used, separate PGND from AGND and connect
them only at one point to avoid the PGND pin noise
coupling to the AGND pin.
O
O
IN
IN
loss
total
I
V
Schottky
FW
V
D
_
)
1
2
inductor
JA
loss
inductor
P
loss
diode
loss
total
junction
Θ
)
_
environmental