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參數(shù)資料
| 型號(hào)： | AOP605L |
| 廠商： | ALPHA |
| 英文描述： | Plastic Encapsulated Device |
| 中文描述： | 塑料封裝器件 |
| 文件頁(yè)數(shù)： | 3/5頁(yè) |
| 文件大?。?/td> | 113K |
| 代理商： | AOP605L |
3
II. Die / Package Information:
Process
AOP605
Standard sub-micron
low voltage complementary process
8 lead PDIP 8 lead PDIP
Copper with Solder Plate
Silver epoxy
2 mils Au wire
Epoxy resin with silica filler
90/10
UL-94 V-0
Ti / Ni / Ag
Up to Level 1 *
AOP605L (Green Compound)
Standard sub-micron
Package Type
Lead Frame
Die Attach
Bond wire
Mold Material
Filler % (Spherical/Flake)
Flammability Rating
Backside Metallization
Moisture Level
Note *
based on info provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOP605 (Standard) &
AOP605L (Green)
Test Item
Test Condition
Time Point
Copper with Solder Plate
Silver epoxy
2 mils Au wire
Epoxy resin with silica filler
100/0
UL-94 V-0
Ti / Ni / Ag
Up to Level 1*
Lot Attribution
Total
Sample size
Number of
Failures
Solder
Reflow
Precondition
Standard: 1hr PCT+3
cycle reflow@250
°
c
Green: 168hr 85
°
c
/85%RH +3 cycle
reflow@250
°
c
Temp = 150
°
c,
Vgs=100% of Vgsmax
0hr
Standard: 11 lots
Green: 4 lots
2365 pcs
0
HTGB
168 / 500
hrs
1000 hrs
168 / 500
hrs
1000 hrs
6 lots
(Note A*)
492 pcs
77+5 pcs / lot
0
HTRB
HAST
Temp = 150
°
c,
Vds=80% of Vdsmax
6 lots
(Note A*)
492 pcs
77+5 pcs / lot
0
130 +/- 2
°
c, 85%RH, 33.3
psi, Vgs = 80% of Vgs
max
100 hrs
Standard: 11 lots
Green: 4 lots
(Note B**)
Standard: 11 lots
Green: 3 lots
(Note B**)
Standard: 11 lots
Green: 3 lots
(Note B**)
825 pcs
50+5 pcs / lot
0
Pressure Pot
121
°
c, 15+/-1 PSIG,
RH=100%
96 hrs
770 pcs
50+5 pcs / lot
0
Temperature
Cycle
-65
°
c to 150
°
c,
air to air
250 / 500
cycles
770 pcs
50+5 pcs / lot
0
DPA
Internal Vision
Cross-section
X-ray
NA
5
5
5
5
5
5
5
5
0
CSAM
NA
0
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| AOP608 | 制造商:ALPHA 制造商全稱:ALPHA 功能描述:韓國(guó)Smartech公司有現(xiàn)貨，價(jià)格優(yōu)惠，有需求公司請(qǐng)發(fā)郵件：liuxy1968@gmail.com或電話：13311270911，中國(guó)聯(lián)系人：劉生 |
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