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參數(shù)資料
| 型號(hào)： | AN8488SB |
| 廠商： | PANASONIC CORP |
| 元件分類(lèi)： | 光電元器件 |
| 英文描述： | 3-phase full-wave motor driver and DC motor BTL driver IC |
| 中文描述： | CD MOTOR DRIVER, PDSO38 |
| 封裝： | 0.400 INCH, PLASTIC, HSOP-42/36 |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 75K |
| 代理商： | AN8488SB |
ICs for Compact Disc/ CD-ROM Player
AN8488SB
7
I
Application Notes (continued)
Power consumption calculation method
You can find a rough value of electric power to be consumed in the IC in the following method and the use of EXCEL
(computer soft ware) will enable you to put it on a graph.
Calculating formula:
(Spindle block)
1. Let an induced voltage generated in each phase as below:
(Reference to a motor center point)
E
A1
=
E
O
×
sin (X) · · · (1)
E
A3
=
E
O
×
sin (X
+
240) · · · (3)
2. Let a current flowing in each phase as below:
I
A1
=
I
O
×
sin (X) · · · (4)
I
A3
=
I
O
×
sin (X
+
240) · · · (6)
3. The voltages generated by a wire-wound resistance of a motor are:
V
R1
=
I
A1
×
R · · · (7)
4. In each phase, add the voltage generated by an induced voltage and that by a wire-wound resistance.
V
A1
'
=
(1)
+
(4)
V
A2
'
=
(2)
+
(5)
5. As the lowest voltage in each phase angle must be 0 V, you can get the voltage to be generated in each phase by
means of subtracting the lowest voltage from the voltage of the remaining two phases.
V
A1
=
V
A1
'
MIN (V
A1
', V
A2
', V
A3
') · · · (10)
V
A2
=
V
A2
'
MIN (V
A1
', V
A2
', V
A3
') · · · (11)
V
A3
=
V
A3
'
MIN (V
A1
', V
A2
', V
A3
') · · · (12)
6. Subtract the supply voltage from each phase's voltage found in item 5 and then multiply it by each phase's current,
so that you can get the power consumption of the spindle block.
E
A2
=
E
O
×
sin (X
+
120) · · · (2)
X: Phase angle
I
A2
=
I
O
×
sin (X
+
120) · · · (5)
V
R2
=
I
A2
×
R · · · (8)
V
R3
=
I
A3
×
R · · · (9)
V
A3
'
=
(3)
+
(6)
3
P
SPD
=
Σ
(
12
V
An
) ×
I
An
n
=
1
(Driver block)
P
SL
=
(V
M2
I
O
· R)
×
I
O
V
M2
: Motor power supply voltage
I
O
: Output current
R: Wire wound resistor
Theory of thermal resistance
A chip temperature or the fin temperature can be understood in the same way as Ohm's Law.
T
j
: Chip temperature
T
a
: Ambient temperature
P
: Electric power generated by IC
R
j-c
: Thermal resistance between a chip and a package
R
c-a
: Thermal resistance between a package and a surface of a heat sink or free air
T
j
=
T
a
+
P
×
(R
j-c
+
R
c-a
)
Make sure that T
j
does not exceed 150
°
C.
If it exceeds 150
°
C, you can suppress the rise of a chip temperature by adding a heat sink which is equivalent to
R
f
in the above figure.
T
j
=
T
a
+
P
×
(R
j-c
+
R
c-a
)
A package surface and the fin are available for a temperature measurement. But the fin part is recommendable for
measurement because a package surface measurement does not always promise you a consistent measuring result.
Note) What has been mentioned above is true to a stationary state, not to a transient state.
R
f
T
j
R
j-c
R
c-a
T
a
P
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