
ICs for Cassette, Cassette Deck
AN7354SC
I
Precautions on Product Handling and Mounting
The AN7354SC Package is dry-sealed, because thermal stress at solder mounting may adversely affect the product reliability due
to the moisture absorption in the resin.
Take into consideration the following instructions for its use :
1. After unpacking the dry sealing package, in order to reduce absorption of the resin, store the product under temperature of
30C or lower and RH65% or less, and perform its mounting within 5 days following the unpacking, except when only lead
section is heated by such as hand soldering. In addition, after unpacking, put the remainder back into the laminate bag and
seal the bag with tapes or similars. Unless the silica gel in the bag discolors (blue to pink), its quality is guaranteed within 10
days.
2. If the product is stored under the conditions more than the above, pre-bake it (for 6 hours or more under 125C, or for 48 hours
more under 70C) before mounting.
3. About soldering method
(1) Solder dip method
Solder dip must be performed under as low temperature as possible not exceeding 260C and for as short time as
possible not exceeding 5s.
(2) Reflow method
((Remarks))
1 Peak temperature : 230C or lower
2 Peak time : 10s or shorter
3
Do not sharply rise the temperature from pre-heat temperature (150C or lower) to peak temperature (230C).
4 Reflow process must be performed only once.
(3) Hand soldering method
When only leads are simultaneously heated, soldering must be performed under as low temperature as possible not
exceeding 300C and for as short time as possible not exceeding 20s.
(4) For any soldering method, do not use the chlorine flux. If the chlorine flux is used, residual chlorine may adversely affect
the product reliability.
Thoroughly clean the IC after mounting. Any flux remaining after mounting results in lead corrosion, degrading the
product reliability. In addition, if supersonic waves are used for cleaning, particular care must be taken, because
resonance may occur depending on the size of IC and printed board.