- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375315 > AN1001 (Vishay Intertechnology,Inc.) The Next Step in Surface-Mount Power MOSFETs PDF資料下載
參數(shù)資料
| 型號(hào)： | AN1001 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | The Next Step in Surface-Mount Power MOSFETs |
| 中文描述： | 在下一步的表面安裝式功率MOSFET |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 56K |
| 代理商： | AN1001 |
AN1001
Vishay Siliconix
Document Number: 70571
12-Dec-03
www.vishay.com
1
LITTLE FOOT TSSOP-8
The Next Step in Surface-Mount Power MOSFETs
Wharton McDaniel and David Oldham
When Vishay Siliconix introduced its LITTLE FOOT
MOSFETs, it was the first time that power MOSFETs had been
offered in a true surface-mount package, the SOIC. LITTLE
FOOT immediately found a home in new small form factor disk
drives, computers, and cellular phones.
The new LITTLE FOOT TSSOP-8 power MOSFETs are the
natural evolutionary response to the continuing demands of
many markets for smaller and smaller packages. LITTLE
FOOT TSSOP-8 MOSFETs have a smaller footprint and a
lower profile than LITTLE FOOT SOICs, while maintaining low
r
DS(on)
and high thermal performance. Vishay Siliconix has
accomplished this by putting one or two high-density MOSFET
die in a standard 8-pin TSSOP package mounted on a custom
leadframe.
THE TSSOP-8 PACKAGE
LITTLE
approximately half the PC board area of an equivalent LITTLE
FOOT device (Figure 1). In addition to the reduction in board
area, the package height has been reduced to 1.1 mm.
FOOT
TSSOP-8
power
MOSFETs
require
Top View
Side View
Figure 1.
An TSSOP-8 Package Next to a SOIC-8 Package
with Views from Both Top and Side
This is the low profile demanded by applications such as
PCMCIA cards.
It reduces the power package to the same height as many
resistors and capacitors in 0805 and 0605 sizes. It also allows
placement on the “passive” side of the PC board.
The standard pinouts of the LITTLE FOOT TSSOP-8
packages have been changed from the standard established
by LITTLE FOOT. This change minimizes the contribution of
interconnection resistance to r
DS(on)
and maximizes the
transfer of heat out of the package.
Figure 2 shows the pinouts for a single-die TSSOP. Notice that
both sides of the package have Source and Drain
connections, whereas LITTLE FOOT has the Source and Gate
connections on one side of the package, and the Drain
connections are on the opposite side.
Figure 2.
Pinouts for Single Die TSSOP
Drain
Source
Source
Gate
Source
Source
Drain
Drain
Figure 3 shows the standard pinouts for a dual-die TSSOP-8.
In this case, the connections for each individual MOSFET
occupy one side.
Figure 3.
Pinouts for Dual-Die TSSOP
Drain 1
Source 1
Source 1
Gate 1
Source 2
Source 2
Drain 2
Gate 2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AN10145 | Bi-directional low voltage translators |
| AN101 | Circular Connector; No. of Contacts:3; Series:MS27508; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:8; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:8-98 RoHS Compliant: No |
| AN104 | AN104 |
| AN105 | FETS AS VOLTAGE-CONTROLLED RESISTORS |
| AN1201SM | Polarity inverting charge pump DC/DC converter IC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AN10-01 | 制造商:SMC Corporation of America 功能描述:Silencer, Compact Resin, Male Thread, 1/8" PT Port, 30 dB(A), 23mm, Model AN10 制造商:SMC 功能描述:Compact silencer Resin R1/8 |
| AN1003 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:陶瓷天線 Multilayer Chip Antenna for 433MHz Wireless Communication |
| AN10038C | 制造商:Panasonic Industrial Company 功能描述:ANTENNA |
| AN-1006 | 制造商:CYMBET 制造商全稱:CYMBET 功能描述:Backing Up Epson Toyocom Real-Time Clock Chips |
| AN100-6 | 制造商:AN# - MILITARY 功能描述: |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。