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參數(shù)資料
| 型號： | AMP03GS |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | Precision, Unity-Gain Differential Amplifier |
| 中文描述： | INSTRUMENTATION AMPLIFIER, 2000 uV OFFSET-MAX, 3 MHz BAND WIDTH, PDSO8 |
| 封裝： | SOIC-8 |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 281K |
| 代理商： | AMP03GS |
AMP03
–3–
REV. E
WAFER TEST LIMITS
(@ V
S
=
6
15 V, T
A
= +25
8
C, unless otherwise noted)
AMP03BC
Limit
Parameter
Symbol
Conditions
Units
Offset Voltage
Gain Error
Input Voltage Range
Common-Mode Rejection
Power Supply Rejection Ratio
Output Swing
Short-Circuit Current Limit
Supply Current
V
OS
V
S
=
±
18 V
No Load, V
IN
=
±
10 V, R
S
= 0
0.5
0.008
±
10
80
8
±
12
+45/–15
3.5
mV max
% max
V min
dB min
μ
V/V max
V max
mA min
mA max
IVR
CMR
PSRR
V
O
I
SC
I
SY
V
CM
=
±
10 V
V
S
=
±
6 V to
±
18 V
R
L
= 2 k
Output Shorted to Ground
No Load
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Input Voltage
2
. . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous
Storage Temperature Range
P, J Package . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . +300
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Operating Temperature Range
AMP03B . . . . . . . . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
AMP03F, AMP03G . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Package Type
u
JA3
u
JC
Units
Header (J)
8-Lead Plastic DIP (P)
8-Lead SOIC (S)
150
103
155
18
43
40
°
C/W
°
C/W
°
C/W
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
For supply voltages less than
±
18 V, the absolute maximum input voltage is equal
to the supply voltage.
3
θ
is specified for worst case mounting conditions, i.e.,
θ
is specified for device
in socket for header and plastic DIP packages and for device soldered to printed
circuit board for SOIC package.
ORDERING GUIDE
1
Temperature
Range
Package
Description
Package
Option
2
Model
AMP03GP
AMP03BJ
AMP03FJ
AMP03BJ/883C
AMP03GS
AMP03GS-REEL
5962-9563901MGA –55
°
C to +125
°
C Header
AMP03GBC
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C Header
–40
°
C to +85
°
C
–40
°
C to +85
°
C
8-Lead Plastic DIP N-8
Header
Header
H-08B
H-08B
H-08B
SO-8
SO-8
H-08B
8-Lead SOIC
8-Lead SOIC
Die
NOTES
1
Burn-in is available on commercial and industrial temperature range parts in
plastic DIP and header packages.
2
For devices processed in total compliance to MIL-STD-883, add /883 after
part number. Consult factory for /883 data sheet.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AMP03 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DICE CHARACTERISTICS
1. Reference
2. –IN
3. +IN
4. V–
5. SENSE
6. OUTPUT
7. V+
8. NC
DIE SIZE 0.076
3
0.076 inch, 5,776 sq. mils
(1.93
3
1.93 mm, 3.73 sq. mm)
BURN-IN CIRCUIT
AMP03
+18V
–18V
25k
V
25k
V
25k
V
SLEW RATE TEST CIRCUIT
AMP03
+15V
–15V
0.1
m
F
0.1
m
F
V
IN
=
6
10V
V
OUT
=
6
10V
WARNING!
ESD SENSITIVE DEVICE
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