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參數(shù)資料
| 型號(hào)： | AMP02GBC |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | Precision Instrumentation Amplifier |
| 中文描述： | INSTRUMENTATION AMPLIFIER, 200 uV OFFSET-MAX, UUC9 |
| 封裝： | DIE-9 |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 266K |
| 代理商： | AMP02GBC |
AMP02E
Min
AMP02F
Min
Parameter
Symbol
Conditions
T yp
Max
T yp
Max
Units
POWER SUPPLY
Supply Voltage Range
Supply Current
V
S
I
SY
±
4.5
±
18
6
6
±
4.5
±
18
6
6
V
mA
mA
T
A
= +25
°
C
–40
°
C
≤
T
A
≤
+85
°
C
5
5
5
5
NOT ES
1
Input voltage range guaranteed by common-mode rejection test.
2
Guaranteed by design.
3
Gain tempco does not include the effects of external component drift.
Specifications subject to change without notice.
ORDE RING GUIDE
V
IOS
max @ V
OOS
max @ T emperature
T
A
= +25
8
C
T
A
= +25
8
C
Package
Description
Model
Range
AMP02EP
AMP02FP
AMP02AZ/883C
AMP02FS
AMP02GBC
AMP02FS-REEL
100
μ
V
200
μ
V
200
μ
V
200
μ
V
4 mV
8 mV
10 mV
8 mV
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
8-Pin Plastic DIP
8-Pin Plastic DIP
8-Pin Cerdip
16-Pin SOIC
Die
16-Pin SOIC
200
μ
V
8 mV
–40
°
C to +85
°
C
ABSOLUT E MAX IMUM RAT INGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Common-Mode Input Voltage .[(V–) – 60 V] to [(V+) + 60 V]
Differential Input Voltage . . . .[(V–) – 60 V] to [(V+) + 60 V]
Output Short-Circuit Duration . . . . . . . . . . . . . . .Continuous
Operating T emperature Range . . . . . . . . . . . . –40
°
C to +85
°
C
Storage T emperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Function T emperature Range . . . . . . . . . . . –65
°
C to +150
°
C
Lead T emperature (Soldering, 10 sec) . . . . . . . . . . . . +300
°
C
Package T ype
u
JA2
u
JC
Units
8-Pin Plastic DIP (P)
16-Pin SOL (S)
96
92
37
27
°
C/W
°
C/W
NOT ES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless oth-
erwise noted.
2
θ
is specified for worst case mounting conditions, i.e.,
θ
is specified for de-
vice in socket for P-DIP package;
θ
JA
is specified for device soldered to printed
circuit board for SOL package.
Figure 2. Simplified Schematic
AMP02
–3–
REV. D
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