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參數(shù)資料
| 型號： | AMMP-6546-TR2G |
| 元件分類： | 混頻器 |
| 英文描述： | 18000 MHz - 40000 MHz RF/MICROWAVE TRIPLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| 封裝： | 5 X 5 MM, SMT, 8 PIN |
| 文件頁數(shù)： | 6/7頁 |
| 文件大小： | 162K |
| 代理商： | AMMP-6546-TR2G |
6
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Neither
Conductive epoxy or hand soldering is recommended.
x Apply solder paste using a stencil printer or dot place-
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room temper-
ature to the pre-heat temperature to avoid damage
due to thermal shock.
x Packages have been qualied to withstand a
peaktemperature of 260°C for 20 seconds. Verify that
the prole will not expose device beyond these limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 13. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencilopenings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127 mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The most commonly used solder reow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reow prole for automatedre-
ow processes is shown in Figure 14. This prole isde-
signed to ensure reliable nished joints. However, the
prole indicated in Figure 14 will vary among dierent
solder pastes from dierent manufacturers and is shown
here for reference only.
Figure 14. Suggested lead-free reow prole for SnAgCu solder paste
AMMP-6546 Part Number Ordering Information
Part Number
No. of Devices
Container
AMMP-6546-BLKG
10
antistatic bag
AMMP-6546-TR1G
100
7” Reel
AMMP-6546-TR2G
500
7” Reel
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Time (Seconds)
Temperature
(°
C)
Ramp 1
Preheat
Ramp 2
Reow
Cooling
Peak = 250 ± 5°C
Melting point = 218°C
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