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參數(shù)資料
| 型號： | AMMP-5618-BLK |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, SURFACE MOUNT PACKAGE-8 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 342K |
| 代理商： | AMMP-5618-BLK |
7
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in the
data sheet, optimizes RF performance and is strongly rec-
ommended. An electronic drawing of the land pattern
is available upon request from Avago Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
Please see recommended solder reflow profile. Con-
ductive epoxy is not recommended. Hand soldering
is not recommended.
4. Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempera-
ture to the pre-heat temperature to avoid damage due
to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
Figure 23. Suggested PCB Material and Land Pattern.
Figure 22. Outline Drawing.
Dimensional tolerance for back view: 0.002" [0.05 mm]
1 2 3
7 6 5
3 2 1
5 6 7
A
AMMP
XXXX
YWWDNN
A
8
4
B
0.114 [2.9]
0.014 [0.365]
0.016 [0.40]
0.012 [0.30]
0.028 [0.70]
0.093 [2.36]
0.016 [0.40]
0.100 [2.54]
0.011 [0.28]
0.018 [0.46]
0.126 [3.2]
0.059 [1.5]
0.100 [2.54]
0.029 [0.75]
4
8
Front View
Symbol
A
B
Min
0.198 (5.03)
0.0685 (1.74)
Max
0.213 (5.4)
0.088 (2.25)
Side View
Back View
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
0.3
.0120
0.41
.0160
0.24
.0095
0.41
.0160
0.25
.0100
3.2
.1260
1.5
.0590
0.51
.0200
0.46
.0180
0.28
.0110
2.37
.0935
0.24
.0095
0.46
.0180
0.114 [2.89]
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-5618-TR1 | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-5618-TR2 | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620_13 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 a?? 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620-BLKG | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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