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| 型號： | AMIS-720341-A |
| 英文描述： | Contact Image Sensor |
| 中文描述： | 接觸式圖像傳感器 |
| 文件頁數(shù)： | 1/16頁 |
| 文件大小： | 1038K |
| 代理商： | AMIS-720341-A |
AMIS-720341-A:
Contact Image Sensor
Data Sheet
1.0 Description
AMI Semiconductor’s AMIS-720341-A (PI3041A) contact image sensor (CIS) chip is a 300 dots per inch (dpi) resolution, linear array
image sensor chip. The sensor chip is processed using a CMOS image sensing technology and it belongs to the Image Sensor Product
Line (ISPL) group within AMIS. Designed for cascading multiple chips in a series, the image sensor chips use a chip-on-board process.
They are bonded end-to-end on a printed circuit board (PCB). This bonding process allows the CIS module manufacturers to produce
variable CIS module lengths in increments of the chip array lengths. Hence, the modules are easily applied in a large number of
document scanners found in today’s facsimile market. Some examples of these large document scanners are those that produce wide
format maps and architectural drawings, down to the narrow width scanners, such as those found in check readers, lotto tickets,
entrance gates tickets, etc. This is not to exclude office automation equipment, which requires an even more variety in scanning widths,
as well as those with special mechanically configurations.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 96 detector elements, their associated
multiplexing switches, buffers, and a chip selector. The detector's element-to-element spacing is approximately 83.3μm. The size of
each chip without scribe lines is 8080μm by 380μm. Each sensor chip has seven bonding pads. The pad symbols and functions are
described in Table 1.
8080 mm
380 mm
Row of 96 Sensors
and Video Signal
Multiplexers
Readout Shift Register
Buffer
Buffer
Chip
Select
Buffer
SP
CP
VDD DGND
IOUT
AGND EOS
Figure 1: AMIS-720341-A Block Diagram
Table 1: Pad Symbols and Functions
Symbol
SP
CP
VDD
DGND
IOUT
AGND
EOS
Function
Start pulse: input clock to start the line scan
Clock pulse: input clock to clock of the shift register
Positive supply: +5V supply connected to substrate
Digital ground: connection topside common
Signal current output: output for video signal current
Analog ground: connection topside common
End-of-scan pulse: output from the shift register at end-of-scan
1
AMI Semiconductor
– May 06, M-20570-001
www.amis.com
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMIS-720442 | 400dpi Contact Image Sensor |
| AMIS-720442-A | 400dpi Contact Image Sensor |
| AMIS-720639 | 600dpi CIS Sensor Chip |
| AMIS-720649 | Contact Image Sensor |
| AMIS-720658 | Contact Image Sensor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMIS-720442 | 制造商:AMI 制造商全稱:AMI 功能描述:400dpi Contact Image Sensor |
| AMIS-720442-A | 制造商:AMI 制造商全稱:AMI 功能描述:400dpi Contact Image Sensor |
| AMIS-720639 | 制造商:AMI 制造商全稱:AMI 功能描述:600dpi CIS Sensor Chip |
| AMIS-720649 | 制造商:AMI 制造商全稱:AMI 功能描述:Contact Image Sensor |
| AMIS-720658 | 制造商:AMI 制造商全稱:AMI 功能描述:Contact Image Sensor |
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