參數(shù)資料
型號(hào): AME8844
廠商: AME, Inc.
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: 750mA CMOS LDO
中文描述: 750mA電流CMOS LDO穩(wěn)壓器
文件頁(yè)數(shù): 12/14頁(yè)
文件大?。?/td> 273K
代理商: AME8844
AME, Inc.
12
750mA CMOS LDO
AME8844
WITH PLATING
BASE METAL
e
R0.127(0.005) TYP
ALL CORNER
& EDGES
TOP PKG.
Top View
Front View
End View
E
E1
PIN 1 I.D
(SHINNY SURFACE)
D
e1
BTM PKG.
L
L1
L2
DETAIL A
b
A1
A2
A
b
b1
c1
c
B
SECTION B-B
E1
B
See Detail A
MIN
MAX
MIN
MAX
A
-
1.07
-
0.04197
A
1
A2
0.05
0.20
0.002
0.008
0.81
0.92
0.032
0.036
b
0.28
0.38
0.011
0.015
b1
0.28
0.33
0.011
0.013
c
0.13
0.23
0.005
0.009
c1
0.13
0.17
0.005
0.006
D
2.90
3.10
0.114
0.122
E
4.77
4.98
0.188
0.196
E1
2.90
3.10
0.114
0.122
e
e1
L
0.406
0.686
0.01598 0.02701
L1
L2
è
0
o
8
o
0
o
8
o
SYMBOLS
MILLIMETERS
INCHES
0.65 TYP
0.0255 TYP
1.95 TYP
0.0767 TYP
0.94 REF
0.037 REF
0.010 TYP
0.254 TYP
n
Package Dimension
MSOP-8
NOTE:
1. Controlling dimension : Millimeter, converted inchdimension
are not necessarily exact.
2. Dimensiioning and tolerancing per ansi Y14.5m-1994.
3. Dimension "d" does not include mold flash,protrusion or gate
burr, mold flash,protrusion and gate burr shall not exceed
0.15mm(0.006") per side. Dimension e1 do not include inter-lead
flash or protrusion, inter-lead flash and protrusion shall not
exceed 0.15mm(0.006") per side.
4. The package top be smaller than the package bottom. Dimen-
sion d and e1 are determined at outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
5. Dimension 'b' does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm(0.0031) total in excess of
the "b" dimension at maximum material condition.
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